TM4C1292NCPDTI3 datasheet, PDF

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TM4C1292NCPDTI3: DescriptionIoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size9MB，1822 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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TM4C1292NCPDTI3 Overview

IoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 85

TM4C1292NCPDTI3 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	TFQFP,
Reach Compliance Code	compli
ECCN code	5A992.C
Factory Lead Time	6 weeks
Has ADC	YES
Address bus width	28
bit size	32
boundary scan	YES
CPU series	CORTEX-M4F
maximum clock frequency	25 MHz
DAC channel	NO
DMA channel	YES
External data bus width	32
Format	FLOATING POINT
Integrated cache	NO
JESD-30 code	S-PQFP-G128
JESD-609 code	e4
length	14 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	32
Number of external interrupt devices
Number of I/O lines	98
Number of serial I/Os	5
Number of terminals	128
Number of timers	8
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	TFQFP
Package shape	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
RAM (bytes)	262144
RAM (number of words)	256
rom(word)	1048576
ROM programmability	FLASH
Maximum seat height	1.2 mm
speed	120 MHz
Maximum slew rate	102.3 mA
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

TM4C1292NCPDTI3 Related Products

	TM4C1292NCPDTI3	TM4C1292NCPDTT3	TM4C1292NCPDTT3R	TM4C1292NCPDTI3R
Description	IoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 85	IoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 105	IoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 105	IoT enabled High performance 32-bit ARM® Cortex®-M4F based MCU 128-TQFP -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	TFQFP,	TFQFP,	TFQFP,	TFQFP,
Reach Compliance Code	compli	compli	compli	compli
Factory Lead Time	6 weeks	6 weeks	6 weeks	8 weeks
Has ADC	YES	YES	YES	YES
Address bus width	28	28	28	28
bit size	32	32	32	32
boundary scan	YES	YES	YES	YES
CPU series	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F	CORTEX-M4F
maximum clock frequency	25 MHz	25 MHz	25 MHz	25 MHz
DAC channel	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES
External data bus width	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	NO	NO	NO	NO
JESD-30 code	S-PQFP-G128	S-PQFP-G128	S-PQFP-G128	S-PQFP-G128
JESD-609 code	e4	e4	e4	e4
length	14 mm	14 mm	14 mm	14 mm
low power mode	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3
Number of DMA channels	32	32	32	32
Number of I/O lines	98	98	98	98
Number of serial I/Os	5	5	5	5
Number of terminals	128	128	128	128
Number of timers	8	8	8	8
On-chip data RAM width	8	8	8	8
On-chip program ROM width	8	8	8	8
Maximum operating temperature	85 °C	105 °C	105 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFQFP	TFQFP	TFQFP	TFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
RAM (bytes)	262144	262144	262144	262144
RAM (number of words)	256	256	256	256
rom(word)	1048576	1048576	1048576	1048576
ROM programmability	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm
speed	120 MHz	120 MHz	120 MHz	120 MHz
Maximum slew rate	102.3 mA	113 mA	113 mA	102.3 mA
Maximum supply voltage	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.4 mm	0.4 mm	0.4 mm	0.4 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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