EEWORLDEEWORLDEEWORLD

Part Number

Search

1206Y0500121FQB

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
CategoryPassive components    capacitor   
File Size695KB,2 Pages
ManufacturerSyfer
Environmental Compliance
Related ProductsFound19parts with similar functions to 1206Y0500121FQB
Download Datasheet Parametric View All

1206Y0500121FQB Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

1206Y0500121FQB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
package instruction, 1206
Reach Compliance Codecompli
ECCN codeEAR99
capacitance0.00012 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high1.6 mm
JESD-609 codee3
length3.2 mm
Manufacturer's serial number1206
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingBULK
positive tolerance1%
Rated (DC) voltage (URdc)50 V
seriesSIZE(HIGH Q)
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrie
Terminal shapeWRAPAROUND
width1.6 mm
Base Number Matches1
High Q
Capacitors
MS Range
The Syfer MS range offers a
very stable, High Q material
system that provides excellent,
low loss performance in
systems below 3GHz. The
range is available in 0402 to
3640 case sizes with various
termination options including
FlexiCap™. This range of high
frequency capacitors is suitable
for many applications where
economical, high performance
is required.
Specification
Capacitance Values
See Capacitance table overleaf
Mechanical
Termination Material
See Ordering Information overleaf
Solderability
IEC 60068-2-58
Printing
Consult sales office
Lead Free Soldering
Termination codes J and Y ranges are
fully compliant with the RoHS and WEEE
directives and parts are compatible
with lead free solders.
Climatic Category
55/125/56
Reeled Quantities
See Capacitance table overleaf
Electrical
Operating Temperature
-55°C to +125°C
Temperature Coefficient
(Typical)
0 ± 30 ppm/°C
Insulation resistance at +25°C
>100GΩ
Insulation resistance at +125°C
>10GΩ
Ageing rate
None
Piezoelectric Effects
None
Dielectric Absorption
None
Dimensions
L1
T
SA
AR MPLE
REF E AVA KITS
IL
E
OR R TO ABLE
S
S
FOR YFER ALES
DET .COM
AIL
S
W
L2
Size
0402
0505
0603
0805
1206
1111
1210
1812
2220
2225
38/09
3640
Length (L1)
mm (inches)
1.00 ± 0.10 (0.039 ± 0.004)
1.40 ± 0.38 (0.055 ± 0.015)
1.60 ± 0.20 (0.063 ± 0.008)
2.00 ± 0.30 (0.080 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
2.79 +0.51 -0.25 (0.11 +0.02 -0.01)
3.20 ± 0.30 (0.126 ± 0.012)
4.50 ± 0.35 (0.180 ± 0.014)
5.70 ± 0.40 (0.225 ± 0.016)
5.70 ± 0.40 (0.225 ± 0.016)
9.15 ± 0.50 (0.360 ± 0.020)
Width (W)
mm (inches)
0.50 ± 0.10 (0.020 ± 0.004)
1.40 ± 0.25 (0.055 ± 0.010)
0.80 ± 0.20 (0.031 ± 0.008)
1.27 ± 0.20 (0.050 ± 0.008)
1.60 ± 0.20 (0.063 ± 0.008)
2.79 ± 0.38 (0.110 ± 0.015)
2.50 ± 0.30 (0.100 ± 0.012)
3.20 ± 0.30 (0.126 ± 0.012)
5.00 ± 0.40 (0.197 ± 0.016)
6.30 ± 0.40 (0.250 ± 0.016)
10.16 ± 0.50 (0.400 ± 0.020)
Thickness (T)
mm (inches)
Termination Band (L2)
mm (inches)
min
max
0.40 (0.016)
0.50 (0.020)
0.40 (0.016)
0.75 (0.030)
0.75 (0.030)
0.63 (0.025)
0.75 (0.030)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.50 (0.059)
0.10 (0.004)
0.13 (0.005)
0.10 (0.004)
0.13 (0.005)
0.25 (0.010)
0.13 (0.005)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.25 (0.010)
0.50 (0.020)
0.60 max (0.024 max)
1.27 max (0.050 max)
0.80 max (0.031 max)
1.30 max (0.051 max)
1.70 max (0.067 max)
2.54 max (0.100 max)
2.00 max (0.079 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)
2.50 max (0.098 max)

1206Y0500121FQB Similar Products

Part Number Manufacturer Description
1206J0500121FCB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FAR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FAT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206A0500121FQT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP
1206A0500121FQB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP
1206Y0500121FAT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206Y0500121FAB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FQT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FCR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206F0500121FCR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FQB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206F0500121FCB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206F0500121FCT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FAB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206J0500121FCT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206Y0500121FAR Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206Y0500121FQT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT
1206H0500121FQB Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP
1206H0500121FQT Syfer Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.00012uF, Surface Mount, 1206, CHIP
Problems with industrial handheld devices
Our company wants to make a handheld device, and the leader asked me to find a solution for a handheld device, an industrial-grade handheld device. I don't know anything about handheld devices, so I s...
chenbingjy ARM Technology
Hello everyone, I want to develop a video surveillance system, please help?
We have cameras, 3G video servers, etc., but I don't know what to do in the early, mid and late stages. What is achieved is monitoring, recording and real-time transmission through a PC....
allen001 Embedded System
[Challenging Energia-ID0201A] A Preliminary Study on TI-MSP430 valueLine
[i=s] This post was last edited by Beifang on 2017-12-21 14:10 [/i] 2 TI-MSP430 MSP430G2xx valueLine The original development board of Arduino is uno, which is a beggar version of the development boar...
北方 TI Technology Forum
The relationship between microcontroller instruction set and operating system
[size=4]1> First, let's discuss the relationship between various single-chip microcomputers and operating systems. [/size] [size=4] [/size] [size=4]Speaking of single-chip microcomputers, the first th...
fish001 Microcontroller MCU
ucos modification
The original task TCB of ucos is a dynamic linked list structure, but now it is changed to static. The general idea is as follows: typedef struct os_tcb_rom { * OS_STK *OSTCBStkPtr; // Pointer to curr...
lxy723 Real-time operating system RTOS
Be open to learning
I saw [b]transistor reverse breakdown[/b] when I was reading a book. Could you please explain what transistor reverse breakdown means? ? Does it mean that the two PN junctions are broken down? Thank y...
songshuheng Analog electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1521  2565  2121  2179  2609  31  52  43  44  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号