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SM32C6713BGDPS20EP

Description
Enhanced Product Floating-Point Digital Signal Processor 272-BGA -55 to 105
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,133 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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SM32C6713BGDPS20EP Overview

Enhanced Product Floating-Point Digital Signal Processor 272-BGA -55 to 105

SM32C6713BGDPS20EP Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
MakerTexas Instruments
Parts packaging codeBGA
package instructionBGA, BGA272,20X20,50
Contacts272
Reach Compliance Codenot_compliant
ECCN code3A001.A.3
Factory Lead Time6 weeks
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width22
barrel shifterNO
bit size32
boundary scanYES
maximum clock frequency200 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheYES
Internal bus architectureMULTIPLE
JESD-30 codeS-PBGA-B272
JESD-609 codee0
length27 mm
low power modeYES
Humidity sensitivity level3
Number of DMA channels16
Number of external interrupt devices4
Number of terminals272
Number of timers2
Maximum operating temperature105 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA272,20X20,50
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)220
power supply1.3,3.3 V
Certification statusNot Qualified
RAM (number of words)65536
Maximum seat height2.57 mm
Maximum supply voltage1.32 V
Minimum supply voltage1.2 V
Nominal supply voltage1.26 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width27 mm
uPs/uCs/peripheral integrated circuit typeDIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches1

SM32C6713BGDPS20EP Related Products

SM32C6713BGDPS20EP SM32C6713BGDPA20EP SM32C6713BGDPM30EP
Description Enhanced Product Floating-Point Digital Signal Processor 272-BGA -55 to 105 Enhanced Product Floating-Point Digital Signal Processor 272-BGA -40 to 105 Enhanced Product Floating-Point Digital Signal Processor 272-BGA -55 to 125
Brand Name Texas Instruments Texas Instruments Texas Instruments
Maker Texas Instruments Texas Instruments Texas Instruments
Parts packaging code BGA BGA BGA
package instruction BGA, BGA272,20X20,50 BGA, BGA272,20X20,50 BGA, BGA272,20X20,50
Contacts 272 272 272
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN code 3A001.A.3 3A001.A.3 3A001.A.2.C
Factory Lead Time 6 weeks 1 week 6 weeks
Other features ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
Address bus width 22 22 22
barrel shifter NO NO NO
bit size 32 32 32
boundary scan YES YES YES
maximum clock frequency 200 MHz 200 MHz 250 MHz
External data bus width 32 32 32
Format FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES
Internal bus architecture MULTIPLE MULTIPLE MULTIPLE
JESD-30 code S-PBGA-B272 S-PBGA-B272 S-PBGA-B272
JESD-609 code e0 e0 e0
length 27 mm 27 mm 27 mm
low power mode YES YES YES
Humidity sensitivity level 3 3 3
Number of DMA channels 16 16 16
Number of external interrupt devices 4 4 4
Number of terminals 272 272 272
Number of timers 2 2 2
Maximum operating temperature 105 °C 105 °C 125 °C
Minimum operating temperature -55 °C -40 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA
Encapsulate equivalent code BGA272,20X20,50 BGA272,20X20,50 BGA272,20X20,50
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 220 220 220
power supply 1.3,3.3 V 1.25,3.3 V 1.2,3.3 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 2.57 mm 2.57 mm 2.57 mm
Maximum supply voltage 1.32 V 1.32 V 1.32 V
Minimum supply voltage 1.2 V 1.2 V 1.2 V
Nominal supply voltage 1.26 V 1.26 V 1.26 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level OTHER INDUSTRIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1 1
RAM (number of words) 65536 4096 -
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