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TM8SR64JPU-10

Description
8MX64 SYNCHRONOUS DRAM MODULE, DMA168, DIMM-168
Categorystorage    storage   
File Size355KB,23 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

TM8SR64JPU-10 Overview

8MX64 SYNCHRONOUS DRAM MODULE, DMA168, DIMM-168

TM8SR64JPU-10 Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeDIMM
package instructionDIMM-168
Contacts168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time7.5 ns
Other featuresAUTO/SELF REFRESH
Spare memory width32
Maximum clock frequency (fCLK)100 MHz
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density536870912 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals168
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply3.3 V
Certification statusNot Qualified
refresh cycle16384
Maximum seat height31.75 mm
self refreshYES
Maximum standby current0.016 A
Maximum slew rate1.56 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL

TM8SR64JPU-10 Related Products

TM8SR64JPU-10 TM16SR64JPU-10 TM16SR72JPU-10
Description 8MX64 SYNCHRONOUS DRAM MODULE, DMA168, DIMM-168 16MX64 SYNCHRONOUS DRAM MODULE, DMA168, DIMM-168 16MX72 SYNCHRONOUS DRAM MODULE, DMA168, DIMM-168
Parts packaging code DIMM DIMM DIMM
package instruction DIMM-168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 168
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 7.5 ns 7.5 ns 7.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Spare memory width 32 32 32
Maximum clock frequency (fCLK) 100 MHz 100 MHz 100 MHz
I/O type COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 536870912 bit 1073741824 bit 1207959552 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 72
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 168 168 168
word count 8388608 words 16777216 words 16777216 words
character code 8000000 16000000 16000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 8MX64 16MX64 16MX72
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 16384 16384 16384
self refresh YES YES YES
Maximum standby current 0.016 A 0.016 A 0.018 A
Maximum slew rate 1.56 mA 1.568 mA 1.764 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Base Number Matches - 1 1
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