|
DAC34H84IZAY |
DAC34H84IZAYR |
| Description |
Quad-Channel, 16-Bit, 1.25-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 196-NFBGA -40 to 85 |
Quad-Channel, 16-Bit, 1.25-GSPS, 1x-16x Interpolating Digital-to-Analog Converter (DAC) 196-NFBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
| package instruction |
LFBGA, BGA196,14X14,32 |
LFBGA, BGA196,14X14,32 |
| Contacts |
196 |
196 |
| Reach Compliance Code |
compli |
compli |
| ECCN code |
EAR99 |
EAR99 |
| Factory Lead Time |
6 weeks |
6 weeks |
| Maximum analog output voltage |
0.6 V |
0.6 V |
| Minimum analog output voltage |
-0.5 V |
-0.5 V |
| Converter type |
D/A CONVERTER |
D/A CONVERTER |
| Enter bit code |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
OFFSET BINARY, 2\'S COMPLEMENT BINARY |
| Input format |
SERIAL |
SERIAL |
| JESD-30 code |
S-PBGA-B196 |
S-PBGA-B196 |
| JESD-609 code |
e1 |
e1 |
| length |
12 mm |
12 mm |
| Humidity sensitivity level |
3 |
3 |
| Number of digits |
16 |
16 |
| Number of functions |
1 |
1 |
| Number of terminals |
196 |
196 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFBGA |
LFBGA |
| Encapsulate equivalent code |
BGA196,14X14,32 |
BGA196,14X14,32 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| power supply |
1.2,3.3 V |
1.2,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| Sampling rate |
1250 MHz |
1250 MHz |
| Maximum seat height |
1.4 mm |
1.4 mm |
| Nominal settling time (tstl) |
0.01 µs |
0.01 µs |
| Maximum slew rate |
820 mA |
820 mA |
| Nominal supply voltage |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
12 mm |
12 mm |