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WEDPN8M64VR-66BM

Description
Synchronous DRAM Module, 8MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Categorystorage    storage   
File Size377KB,13 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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WEDPN8M64VR-66BM Overview

Synchronous DRAM Module, 8MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219

WEDPN8M64VR-66BM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1820319346
Parts packaging codeBGA
package instructionBGA,
Contacts219
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time7.5 ns
Other featuresAUTO REFRESH
Spare memory width32
JESD-30 codeR-PBGA-B219
memory density536870912 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals219
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize8MX64
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
WEDPN8M64VR-XBX
8Mx64 Registered Synchronous DRAM
FEATURES
!
Registered for enhanced performance of bus speeds
of 66 MHz and 100 MHz
!
Package:
• 219 Plastic Ball Grid Array (PBGA), 32 x 25mm
!
Single 3.3V ±0.3V power supply
!
Fully synchronous; all signals registered on positive edge
of system clock cycle
!
Internal pipelined operation; column address can be
changed every clock cycle
!
Internal banks for hiding row access/precharge
!
Programmable Burst length 1,2,4,8 or full page
!
4096 refresh cycles
!
Commercial, Industrial and Military Temperature Ranges
!
Organized as 8M x 64
• User configurable as 2x8Mx32 or 4x8Mx16
!
Weight: WEDPN8M64VR-XBX - 2.5 grams typical
GENERAL DESCRIPTION
The 64MByte (512Mb) SDRAM is a high-speed CMOS, dy-
namic random-access memory using 4 chips containing
134,217,728 bits. Each chip is internally configured as a
quad-bank DRAM with a synchronous interface. Each of the
chip’s 33,554,432-bit banks is organized as 4,096 rows by
512 columns by 16 bits. The MCP also incorporates two
16-bit universal bus drivers for input control signals and ad-
dress.
Read and write accesses to the SDRAM are burst oriented;
accesses start at a selected location and continue for a pro-
grammed number of locations in a programmed sequence.
Accesses begin with the registration of an ACTIVE com-
mand, which is then followed by a READ or WRITE com-
mand. The address bits registered coincident with the AC-
TIVE command are used to select the bank and row to be
accessed (BA0, BA1 select the bank; A0-11 select the row).
The address bits registered coincident with the READ or
WRITE command are used to select the starting column lo-
cation for the burst access.
The SDRAM provides for programmable READ or WRITE burst
lengths of 1, 2, 4 or 8 locations, or the full page, with a
burst terminate option. An AUTO PRECHARGE function may
be enabled to provide a self-timed row precharge that is
initiated at the end of the burst sequence.
The 512Mb SDRAM uses an internal pipelined architecture
to achieve high-speed operation. This architecture is com-
patible with the 2n rule of prefetch architectures, but it also
allows the column address to be changed on every clock
cycle to achieve a high-speed, fully random access.
Precharging one bank while accessing one of the other three
banks will hide the precharge cycles and provide seam-
less, high-speed, random-access operation.
The 512Mb SDRAM is designed to operate in 3.3V, low-
power memory systems. An auto refresh mode is provided,
along with a power-saving, power-down mode.
All inputs and outputs are LVTTL compatible. SDRAMs offer
substantial advances in DRAM operating performance, in-
cluding the ability to synchronously burst data at a high data
rate with automatic column-address generation, the ability
to interleave between internal banks in order to hide
precharge time and the capability to randomly change col-
umn addresses on each clock cycle during a burst access.
BENEFITS
!
41% SPACE SAVINGS
!
Reduced part count
!
Reduced trace lengths for lower parasitic capacitance
!
Glueless connection to memory controller/PCI bridge
!
Laminate interposer for optimum TCE match
!
Suitable for hi-reliability applications
!
Upgradeable to 16M x 64 density (contact factory for
information)
* This data sheet describes a product that is subject to change without notice.
November 2003 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

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Description Synchronous DRAM Module, 8MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 Synchronous DRAM Module, 8MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 Synchronous DRAM Module, 8MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 Synchronous DRAM Module, 8MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 Synchronous DRAM Module, 8MX64, 7.5ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219 Synchronous DRAM Module, 8MX64, 6ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Objectid 1820319346 1820319342 1904870563 1820319345 1820319344 1820319341
package instruction BGA, BGA, 32 X 25 MM, PLASTIC, BGA-219 BGA, BGA, BGA,
Reach Compliance Code compliant compliant unknown compliant compliant compliant
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 7.5 ns 6 ns 6 ns 7.5 ns 7.5 ns 6 ns
Other features AUTO REFRESH AUTO/SELF REFRESH AUTO REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
Spare memory width 32 32 32 32 32 32
JESD-30 code R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219 R-PBGA-B219
memory density 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 64 64 64 64 64 64
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 219 219 219 219 219 219
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 85 °C 125 °C 85 °C 70 °C 70 °C
Minimum operating temperature -55 °C -40 °C -55 °C -40 °C - -
organize 8MX64 8MX64 8MX64 8MX64 8MX64 8MX64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY INDUSTRIAL MILITARY INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Is it lead-free? Contains lead Contains lead - Contains lead Contains lead Contains lead
Parts packaging code BGA BGA - BGA BGA BGA
Contacts 219 219 - 219 219 219
ECCN code EAR99 EAR99 - EAR99 EAR99 EAR99
self refresh - YES - YES YES YES

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