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STUF32864EHLFT

Description
D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96
Categorylogic    logic   
File Size138KB,13 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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STUF32864EHLFT Overview

D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96

STUF32864EHLFT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionMO-205CC, BGA-96
Contacts96
Reach Compliance Codecompliant
seriesSSTU
JESD-30 codeR-PBGA-B96
JESD-609 codee3
length13.5 mm
Logic integrated circuit typeD FLIP-FLOP
Number of digits25
Number of functions1
Number of terminals96
Maximum operating temperature70 °C
Minimum operating temperature
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)2 ns
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Trigger typePOSITIVE EDGE
width5.5 mm
minfmax270 MHz
Integrated
Circuit
Systems, Inc.
ICSSSTUF32864
25-Bit Configurable Registered Buffer for DDR2
Recommended Application:
DDR2 Memory Modules
Provides complete DDR DIMM solution with
ICS97U877
Ideal for DDR2 400, 533 and 667
Product Features:
25-bit 1:1 or 14-bit 1:2 configurable registered buffer
Supports SSTL_18 JEDEC specification on data
inputs and outputs
Supports LVCMOS switching levels on CSR# and
RESET# inputs
Low voltage operation
V
DD
= 1.7V to 1.9V
Available in 96 BGA package
Drop-in replacement for ICSSSTUF32866
Green packages available
Pin Configuration
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
2
3
4
5
6
96 Ball BGA
(Top View)
Truth Table
I nputs
RST#
H
H
H
H
H
H
H
H
H
H
H
H
L
DCS#
L
L
L
L
L
L
H
H
H
H
H
H
X or
Floating
CSR#
L
L
L
H
H
H
L
L
L
H
H
H
X or
Floating
L or H
X or
Floating
L or H
X or
Floating
L or H
L or H
L or H
L or H
L or H
L or H
CK
CK#
Dn,
DODT,
DCK E
L
H
X
L
H
X
L
H
X
L
H
X
X or
Floating
Qn
L
H
Q
0
L
H
Q
0
L
H
Q
0
Q
0
Q
0
Q
0
L
Outputs
QCS#
L
L
Q
0
L
L
Q
0
H
H
Q
0
H
H
Q
0
L
QODT,
QCKE
L
H
Q
0
L
H
Q
0
L
H
Q
0
L
H
Q
0
L
Ball Assignments
A
DCKE
B
D2
C
D3
D
DODT
E
D5
F
D6
G
NC
H
CK
J
CK#
K
D8
L
D9
NC
D15
D16
NC
D17
D18
RST#
DCS#
CSR#
D19
D20
D21
D22
D23
D24
D25
V
REF
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
V
REF
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
GND
V
DD
V
DD
QCKE
Q2
Q3
QODT
Q5
Q6
C1
QCS#
ZOH
Q8
Q9
Q10
Q11
Q12
Q13
Q14
NC
Q15
Q16
NC
Q17
Q18
C0
NC
ZOL
Q19
Q20
Q21
Q22
Q23
Q24
Q25
M
D10
N
D11
P
D12
R
D13
T
D14
1
2
3
4
5
6
1:1 Register (C0 = 0, C1 = 0)
0880A—04/16/04

STUF32864EHLFT Related Products

STUF32864EHLFT ICSSTUF32864EH ICSSTUF32864EHLF ICSSTUF32864EHLFT ICSSTUF32864EHT STUF32864EHLF
Description D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, MO-205CC, BGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, GREEN, MO-205CC, BGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96 D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96, MO-205CC, BGA-96
Is it lead-free? Lead free Contains lead Lead free Lead free Contains lead Lead free
Is it Rohs certified? conform to incompatible conform to conform to incompatible conform to
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA BGA
package instruction MO-205CC, BGA-96 MO-205CC, BGA-96 GREEN, MO-205CC, BGA-96 GREEN, MO-205CC, BGA-96 MO-205CC, BGA-96 MO-205CC, BGA-96
Contacts 96 96 96 96 96 96
Reach Compliance Code compliant compliant compliant compliant compliant compliant
series SSTU SSTU SSTU SSTU SSTU SSTU
JESD-30 code R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
JESD-609 code e3 e0 e3 e3 e0 e3
length 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm 13.5 mm
Logic integrated circuit type D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Number of digits 25 25 25 25 25 25
Number of functions 1 1 1 1 1 1
Number of terminals 96 96 96 96 96 96
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFBGA LFBGA LFBGA LFBGA LFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 225 260 260 225 260
propagation delay (tpd) 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Tin/Lead (Sn/Pb) MATTE TIN MATTE TIN Tin/Lead (Sn/Pb) MATTE TIN
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30 30 30
Trigger type POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm 5.5 mm
minfmax 270 MHz 270 MHz 270 MHz 270 MHz 270 MHz 270 MHz
Is Samacsys - N N N N -
Base Number Matches - 1 1 1 1 -
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