Memory is the highest density nonvolatile read write solution for solid-
state storage The 28F008SA-L’s extended cycling symmetrically-blocked architecture fast access time write
automation and very low power consumption provide a more reliable lower power lighter weight and higher
performance alternative to traditional rotating disk technology The 28F008SA-L brings new capabilities to
portable computing Application and operating system software stored in resident flash memory arrays provide
instant-on rapid execute-in-place and protection from obsolescence through in-system software updates
Resident software also extends system battery life and increases reliability by reducing disk drive accesses
For high-density data acquisition applications the 28F008SA-L offers a more cost-effective and reliable alter-
native to SRAM and battery Traditional high-density embedded applications such as telecommunications
can take advantage of the 28F008SA-L’s nonvolatility blocking and minimal system code requirements for
flexible firmware and modular software designs
The 28F008SA-L is offered in 40-lead TSOP (standard and reverse) and 44-lead PSOP packages Pin assign-
ments simplify board layout when integrating multiple devices in a flash memory array or subsystem This
device uses an integrated Command User Interface and state machine for simplified block erasure and byte
write The 28F008SA-L memory map consists of 16 separately erasable 64-Kbyte blocks
Intel’s 28F008SA-L employs advanced CMOS circuitry for systems requiring low power consumption and
noise immunity Its 200 ns access time provides superior performance when compared with magnetic storage
media A deep power-down mode lowers power consumption to 0 66
mW
typical thru V
CC
crucial in portable
computing handheld instrumentation and other low-power applications The RP power control input also
provides absolute data protection during system power-up down
Manufactured on Intel’s 0 8 micron ETOX process the 28F008SA-L provides the highest levels of quality
reliability and cost-effectiveness
Other brands and names are property of their respective owners
Other brands and names are the property of their respective owners
Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or
copyright for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products Intel retains the right to make
changes to these specifications at any time without notice Microcomputer Products may have minor variations to this specification known as errata
COPYRIGHT
INTEL CORPORATION 1995
December 1995
Order Number 290435-005
28F008SA-L
The
Status Register
indicates the status of the
WSM and when the WSM successfully completes
the desired byte write or block erase operation
The
RY BY
output gives an additional indicator of
WSM activity providing capability for both hardware
signal of status (versus software polling) and status
masking (interrupt masking for background erase
for example) Status polling using RY BY mini-
mizes both CPU overhead and system power con-
sumption When low RY BY indicates that the
WSM is performing a block erase or byte write oper-
ation RY BY high indicates that the WSM is ready
for new commands block erase is suspended or the
device is in deep powerdown mode
Maximum access time is
200 ns (t
ACC
)
over the
commercial temperature range (0 C to
a
70 C) and
over V
CC
supply voltage range (3 0V to 3 6V and
4 5V to 5 5V)
I
CC
active current
(CMOS Read) is
5 mA typical 12 mA maximum
at
5 MHz
3 3V
g
0 3V
When the CE and RP pins are at V
CC
the
I
CC
CMOS Standby
mode is enabled
A
Deep Powerdown
mode is enabled when the
RP pin is at GND minimizing power consumption
and providing write protection
I
CC
current
in deep
powerdown is
0 20
mA
typical
Reset time of 500 ns
is required from RP switching high until outputs are
valid to read attempts Equivalently the device has a
wake time of 1
ms
from RP high until writes to the
Command User Interface are recognized by the
28F008SA-L With RP at GND the WSM is reset
and the Status Register is cleared
PRODUCT OVERVIEW
The 28F008SA-L is a high-performance
8-Mbit
(8 388 608-bit) memory organized as
1 Mbyte
(1 048 576 bytes) of 8 bits each
Sixteen 64-Kbyte
(65 536-byte)
blocks
are included on the
28F008SA-L A memory map is shown in Figure 6 of
this specification A block erase operation erases
one of the sixteen blocks of memory in typically
2 0
seconds
independent of the remaining blocks
Each block can be independently erased and written
10 000 cycles Erase Suspend
mode allows sys-
tem software to suspend block erase to read data or
execute code from any other block of the
28F008SA-L
The 28F008SA-L is available in the
40-lead TSOP
(Thin Small Outline Package 1 2 mm thick) and
44-
lead PSOP
(Plastic Small Outline) packages Pin-
outs are shown in Figures 2 and 4 of this specifica-
tion
The
Command User Interface
serves as the inter-
face between the microprocessor or microcontroller
and the internal operation of the 28F008SA-L
Byte Write and Block Erase Automation
allow
byte write and block erase operations to be execut-
ed using a two-write command sequence to the
Command User Interface The internal
Write State
Machine
(WSM) automatically executes the algo-
rithms and timings necessary for byte write and
block erase operations including verifications
thereby unburdening the microprocessor or micro-
controller Writing of memory data is performed in
byte increments typically within 11
ms
I
PP
byte
write and block erase currents
are
10 mA typical
30 mA maximum V
PP
byte write and block erase
voltage
is
11 4V to 12 6V
2
28F008SA-L
Figure 1 Block Diagram
3
290435– 1
28F008SA-L
Table 1 Pin Description
Symbol
A
0
–A
19
DQ
0
–DQ
7
Type
INPUT
INPUT OUTPUT
Name and Function
ADDRESS INPUTS
for memory addresses Addresses are internally
latched during a write cycle
DATA INPUT OUTPUTS
Inputs data and commands during Command
User Interface write cycles outputs data during memory array Status
Register and Identifier read cycles The data pins are active high and
float to tri-state off when the chip is deselected or the outputs are
disabled Data is internally latched during a write cycle
CHIP ENABLE
Activates the device’s control logic input buffers
decoders and sense amplifiers CE is active low CE high deselects
the memory device and reduces power consumption to standby levels
RESET DEEP POWERDOWN
Puts the device in deep powerdown
mode RP is active low RP high gates normal operation RP also
locks out block erase or byte write operations when active low providing
data protection during power transitions RP active resets internal
automation Exit from Deep Powerdown sets device to read-array mode
OUTPUT ENABLE
Gates the device’s outputs through the data buffers
during a read cycle OE is active low
WRITE ENABLE
Controls writes to the Command User Interface and
array blocks WE is active low Addresses and data are latched on the
rising edge of the WE pulse
READY BUSY
Indicates the status of the internal Write State
Machine When low it indicates that the WSM is performing a block
erase or byte write operation RY BY high indicates that the WSM is
ready for new commands block erase is suspended or the device is in
deep powerdown mode RY BY is always active and does
NOT
float
to tri-state off when the chip is deselected or data outputs are disabled
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