MT28F004B3VG-8B datasheet, PDF

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MT28F004B3VG-8B: DescriptionFlash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40; Categorystorage storage; File Size443KB，30 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT28F004B3VG-8B Overview

Flash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40

MT28F004B3VG-8B Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	TSOP1
package instruction	10 X 20 MM, PLASTIC, TSOP1-40
Contacts	40
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	80 ns
Other features	BOTTOM BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Data polling	NO
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G40
JESD-609 code	e0
length	18.4 mm
memory density	4194304 bi
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	1,2,1,3
Number of terminals	40
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP40,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	235
power supply	3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Department size	16K,8K,96K,128K
Maximum standby current	0.000005 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
switch bit	NO
type	NOR TYPE
width	10 mm
Base Number Matches	1

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4Mb

SMART 3 BOOT BLOCK FLASH MEMORY

FLASH MEMORY

Features

• Seven erase blocks:

16KB/8K-word boot block (protected)

Two 8KB/4K-word parameter blocks

Four main memory blocks

• Smart 3 technology (B3):

3.3V ±0.3V V

3.3V ±0.3V

application programming

5V ±10%

application/production programming

• Compatible with 0.3µm Smart 3 device

• Advanced 0.18µm CMOS floating-gate process

• Address access time: 80ns

• 100,000 ERASE cycles

• Industry-standard pinouts

• Inputs and outputs are fully TTL-compatible

• Automated write and erase algorithm

• Two-cycle WRITE/ERASE sequence

• Byte- or word-wide READ and WRITE

(MT28F400B3, 256K x 16/512K x 8)

• Byte-wide READ and WRITE only

(MT28F004B3, 512K x 8)

•

TSOP and SOP packaging options

MT28F004B3

MT28F400B3

3V ONLY, DUAL SUPPLY (SMART 3)

40-Pin TSOP Type I

48-Pin TSOP Type I

44-Pin SOP

GENERAL DESCRIPTION

The MT28F004B3 (x8) and MT28F400B3 (x16/x8)

are nonvolatile, electrically block-erasable (flash),

programmable memory devices containing 4,194,304

bits organized as 262,144 words (16 bits) or 524,288

bytes (8 bits). Writing or erasing the device is done with

either a 3.3V or 5V V

voltage, while all operations are

performed with a 3.3V V

. Due to process technology

advances, 5V V

is optimal for application and pro-

duction programming. These devices are fabricated

with Micron’s advanced 0.18µm CMOS floating-gate

process.

The MT28F004B3 and MT28F400B3 are organized

into seven separately erasable blocks. To ensure that

critical firmware is protected from accidental erasure

or overwrite, the devices feature a hardware-protected

boot block. Writing or erasing the boot block requires

either applying a super-voltage to the RP# pin or driv-

ing WP# HIGH in addition to executing the normal

write or erase sequences. This block may be used to

store code implemented in low-level system recovery.

The remaining blocks vary in density and are written

and erased with no additional security measures.

Refer to Micron’s Web site (www.micron.com/flash)

for the latest data sheet.

Part Number Example:

Options

•

Timing

80ns access

Configurations

1 Meg x 8

512K x 16/1 Meg x 8

Boot Block Starting Word Address

Top (3FFFFh)

Bottom (00000h)

Operating Temperature Range

Extended (-40ºC to +85ºC)

Packages

MT28F004B3

Plastic 40-pin (standard) TSOP Type I

Plastic 40-pin (lead free) TSOP Type

MT28F400B3

Plastic 48-pin (standard) TSOP Type I

Plastic 48-pin (lead free) TSOP Type I

Plastic 44-pin (standard) SOP

Plastic 44-pin (lead free) SOP

Marking

-8

MT28F004B3

MT28F400B3

NOTE:

1. This generation of devices does not support 12V

production programming; however, 5V

application production programming can be

used with no loss of performance.

2. Contact Factory for availability

MT28F400B3SG-8 T

09005aef8114a789

F45.fm - Rev. E 6/04 EN

PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.

MT28F004B3VG-8B Related Products

	MT28F004B3VG-8B	MT28F004B3VG-8T	MT28F004B3VG-8TET	MT28F004B3VG-8BET	MT28F400B3SG-8B	MT28F400B3WG-8B
Description	Flash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40	Flash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40	Flash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40	Flash, 512KX8, 80ns, PDSO40, 10 X 20 MM, PLASTIC, TSOP1-40	Flash, 256KX16, 80ns, PDSO44, 0.500 INCH, PLASTIC, SOP-44	Flash, 256KX16, 80ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	TSOP1	TSOP1	TSOP1	TSOP1	SOIC	TSOP1
package instruction	10 X 20 MM, PLASTIC, TSOP1-40	10 X 20 MM, PLASTIC, TSOP1-40	10 X 20 MM, PLASTIC, TSOP1-40	10 X 20 MM, PLASTIC, TSOP1-40	0.500 INCH, PLASTIC, SOP-44	12 X 20 MM, PLASTIC, TSOP1-48
Contacts	40	40	40	40	44	48
Reach Compliance Code	_compli	_compli	_compli	_compli	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	80 ns	80 ns	80 ns	80 ns	80 ns	80 ns
Other features	BOTTOM BOOT BLOCK	TOP BOOT BLOCK	TOP BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK
startup block	BOTTOM	TOP	TOP	BOTTOM	BOTTOM	BOTTOM
command user interface	YES	YES	YES	YES	YES	YES
Data polling	NO	NO	NO	NO	NO	NO
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G40	R-PDSO-G44	R-PDSO-G48
JESD-609 code	e0	e0	e0	e0	e0	e0
length	18.4 mm	18.4 mm	18.4 mm	18.4 mm	28.02 mm	18.4 mm
memory density	4194304 bi	4194304 bi	4194304 bi	4194304 bi	4194304 bit	4194304 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8	16	16
Number of functions	1	1	1	1	1	1
Number of departments/size	1,2,1,3	1,2,1,3	1,2,1,3	1,2,1,3	1,2,1,3	1,2,1,3
Number of terminals	40	40	40	40	44	48
word count	524288 words	524288 words	524288 words	524288 words	262144 words	262144 words
character code	512000	512000	512000	512000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	256KX16	256KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP1	TSOP1	TSOP1	SOP	TSOP1
Encapsulate equivalent code	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	TSSOP40,.8,20	SOP44,.63	TSSOP48,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	235	235	235	235	235	235
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	2.8 mm	1.2 mm
Department size	16K,8K,96K,128K	16K,8K,96K,128K	16K,8K,96K,128K	16K,8K,96K,128K	16K,8K,96K,128K	16K,8K,96K,128K
Maximum standby current	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A	0.000005 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30
switch bit	NO	NO	NO	NO	NO	NO
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	10 mm	10 mm	10 mm	10 mm	12.6 mm	12 mm
Base Number Matches	1	1	1	1	-	-

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