A3P030-QNG68Y datasheet, PDF - EEWORLD Datasheet

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A3P030-QNG68Y: DescriptionField Programmable Gate Array, 768 CLBs, 30000 Gates, CMOS, 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFP-68; CategoryProgrammable logic devices Programmable logic; File Size6MB，221 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com; Environmental Compliance

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A3P030-QNG68Y Overview

Field Programmable Gate Array, 768 CLBs, 30000 Gates, CMOS, 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFP-68

A3P030-QNG68Y Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microsemi
package instruction	VQCCN,
Reach Compliance Code	compliant
JESD-30 code	S-XQCC-N68
length	8 mm
Humidity sensitivity level	3
Configurable number of logic blocks	768
Equivalent number of gates	30000
Number of terminals	68
Maximum operating temperature	85 °C
Minimum operating temperature
organize	768 CLBS, 30000 GATES
Package body material	UNSPECIFIED
encapsulated code	VQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, VERY THIN PROFILE
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Maximum seat height	1 mm
Maximum supply voltage	1.575 V
Minimum supply voltage	1.425 V
Nominal supply voltage	1.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
width	8 mm

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Revision 18

DS0097

ProASIC3 Flash Family FPGAs

with Optional Soft ARM Support

Features and Benefits

High Capacity

• 15 K to 1 M System Gates

• Up to 144 Kbits of True Dual-Port SRAM

• Up to 300 User I/Os

Advanced I/O

• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)

• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

• Wide Range Power Supply Voltage Support per JESD8-B,

Allowing I/Os to Operate from 2.7 V to 3.6 V

• Bank-Selectable I/O Voltages—up to 4 Banks per Chip

• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /

2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X

†

and LVCMOS

2.5 V / 5.0 V Input

• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and

M-LVDS (A3P250 and above)

• I/O Registers on Input, Output, and Enable Paths

• Hot-Swappable and Cold Sparing I/Os

‡

• Programmable Output Slew Rate

†

and Drive Strength

• Weak Pull-Up/-Down

• IEEE 1149.1 (JTAG) Boundary Scan Test

• Pin-Compatible Packages across the ProASIC3 Family

• Six CCC Blocks, One with an Integrated PLL

• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities

and External Feedback

• Wide Input Frequency Range (1.5 MHz to 350 MHz)

• 1 Kbit of FlashROM User Nonvolatile Memory

• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM

Blocks (×1, ×2, ×4, ×9, and ×18 organizations)

†

• True Dual-Port SRAM (except ×18)

Reprogrammable Flash Technology

• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS

Process

• Instant On Level 0 Support

• Single-Chip Solution

• Retains Programmed Design when Powered Off

High Performance

• 350 MHz System Performance

• 3.3 V, 66 MHz 64-Bit PCI

†

In-System Programming (ISP) and Security

• ISP Using On-Chip 128-Bit Advanced Encryption Standard

(AES) Decryption (except ARM

-enabled ProASIC

3 devices)

via JTAG (IEEE 1532–compliant)

†

• FlashLock

to Secure FPGA Contents

Clock Conditioning Circuit (CCC) and PLL

†

Low Power

• Core Voltage for Low Power

• Support for 1.5 V-Only Systems

• Low-Impedance Flash Switches

Embedded Memory

†

High-Performance Routing Hierarchy

• Segmented, Hierarchical Routing and Clock Structure

ARM Processor Support in ProASIC3 FPGAs

ProASIC3 Devices

A3P015

A3P030

A3P060 A3P125

A3P250

A3P400

A3P600

Cortex-M1 Devices

M1A3P250 M1A3P400

M1A3P600

System Gates

15,000

30,000

60,000 125,000

250,000

400,000

600,000

Typical Equivalent Macrocells

128

256

512

1,024

2,048

–

VersaTiles (D-flip-flops)

384

768

1,536

3,072

6,144

9,216

13,824

RAM Kbits (1,024 bits)

–

108

4,608-Bit Blocks

–

FlashROM Kbits

Secure (AES) ISP

–

Yes

Integrated PLL in CCCs

–

VersaNet Globals

I/O Banks

Maximum User I/Os

133

157

194

235

Notes:

1. A3P015 is not recommended for new designs.

2. Refer to the

Cortex-M1

product brief for more information.

3. AES is not available for Cortex-M1 ProASIC3 devices.

4. Six chip (main) and three quadrant global networks are available for A3P060 and above.

5. The M1A3P250 device does not support this package.

6. For higher densities and support of additional features, refer to the

ProASIC3E Flash Family FPGAs

datasheet.

7. Package not available.

• M1 ProASIC3 Devices—ARM

Cortex

-M1 Soft Processor

Available with or without Debug

A3P1000

M1A3P1000

1,000,000

–

24,576

144

Yes

300

† A3P015 and A3P030 devices do not support this feature.

‡ Supported only by A3P015 and A3P030 devices.

March 2016

ProASIC3 Flash Family FPGAs

ProASIC3 Device Family Overview

General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1

ProASIC3 DC and Switching Characteristics

General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15

VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-81

Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-85

Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-90

Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-92

Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-107

JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-108

Pin Descriptions

Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3-1

3-2

3-3

3-4

Package Pin Assignments

QN48 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1

QN68 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3

QN132 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6

CS121 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15

VQ100 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18

TQ144 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23

PQ208 – Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28

FG144 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39

FG256 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-52

FG484 – Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-65

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1

Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15

R ev i si o n 1 8

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