High performance 32-bit ARM® Cortex®-M4F based MCU 64-LQFP -40 to 85
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | QFP |
| package instruction | LFQFP, |
| Contacts | 64 |
| Reach Compliance Code | compli |
| Factory Lead Time | 6 weeks |
| Has ADC | YES |
| Address bus width | |
| bit size | 32 |
| boundary scan | YES |
| CPU series | CORTEX-M4F |
| maximum clock frequency | 25 MHz |
| DAC channel | NO |
| DMA channel | YES |
| External data bus width | |
| Format | FLOATING POINT |
| Integrated cache | NO |
| JESD-30 code | S-PQFP-G64 |
| JESD-609 code | e4 |
| length | 10 mm |
| low power mode | YES |
| Humidity sensitivity level | 3 |
| Number of DMA channels | 32 |
| Number of external interrupt devices | |
| Number of I/O lines | 49 |
| Number of serial I/Os | 5 |
| Number of terminals | 64 |
| Number of timers | 12 |
| On-chip data RAM width | 8 |
| On-chip program ROM width | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFQFP |
| Package shape | SQUARE |
| Package form | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| RAM (bytes) | 24576 |
| RAM (number of words) | 12 |
| rom(word) | 65536 |
| ROM programmability | FLASH |
| Maximum seat height | 1.6 mm |
| speed | 80 MHz |
| Maximum slew rate | 54.9 mA |
| Maximum supply voltage | 1.32 V |
| Minimum supply voltage | 1.08 V |
| Nominal supply voltage | 1.2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |
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