UCC3752DG4 datasheet, PDF - EEWORLD Datasheet

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UCC3752DG4: DescriptionCommunication ICs - Various Resonant Ring Generator Controller; CategoryWireless rf/communication Telecom circuit; File Size92KB，7 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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UCC3752DG4 Overview

Communication ICs - Various Resonant Ring Generator Controller

UCC3752DG4 Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Contains lead
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	SOIC
package instruction	SOP, SOP16,.25
Contacts	16
Reach Compliance Code	unknow
JESD-30 code	R-PDSO-G16
length	9.9 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	12 V
Certification status	Not Qualified
Maximum seat height	1.75 mm
Maximum slew rate	0.003 mA
Nominal supply voltage	12 V
surface mount	YES
technology	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm

UCC3752DG4 Related Products

	UCC3752DG4	UCC3752D	UCC3752N	UCC3752NG4
Description	Communication ICs - Various Resonant Ring Generator Controller	Communication ICs - Various Resonant Ring Generator Controller	Communication ICs - Various Resonant Ring Generator Controller	Communication ICs - Various Resonant Ring Generator Controller
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	SOIC	SOIC	DIP	DIP
package instruction	SOP, SOP16,.25	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3
Contacts	16	16	16	16
Reach Compliance Code	unknow	unknow	unknow	unknow
JESD-30 code	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16	R-PDIP-T16
length	9.9 mm	9.9 mm	19.305 mm	19.305 mm
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	DIP	DIP
Encapsulate equivalent code	SOP16,.25	SOP16,.25	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	12 V	12 V	12 V	12 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.75 mm	1.75 mm	5.08 mm	5.08 mm
Maximum slew rate	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Nominal supply voltage	12 V	12 V	12 V	12 V
surface mount	YES	YES	NO	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3.9 mm	3.9 mm	7.62 mm	7.62 mm

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