TS3USB32008RSVR datasheet, PDF

TS3USB32008RSVR: DescriptionUSB 2.0 High-Speed and Mobile High-Definition Link Switch w/ ID Select and Flexible Power Control 16-UQFN -40 to 85; CategoryAnalog mixed-signal IC The signal circuit; File Size1MB，22 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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USB 2.0 High-Speed and Mobile High-Definition Link Switch w/ ID Select and Flexible Power Control 16-UQFN -40 to 85

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
package instruction	VQCCN,
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Analog Integrated Circuits - Other Types	DPDT
Nominal bandwidth	5500 MHz
Maximum input voltage	3.6 V
Minimum input voltage
JESD-30 code	R-PQCC-N16
JESD-609 code	e4
length	2.6 mm
Humidity sensitivity level	1
Number of channels	2
Number of functions	1
Number of terminals	16
Nominal off-state isolation	37 dB
On-state resistance matching specifications	0.4 Ω
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
output	SEPARATE OUTPUT
Package body material	PLASTIC/EPOXY
encapsulated code	VQCCN
Package shape	RECTANGULAR
Package form	CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	0.55 mm
Maximum supply current (Isup)	0.00007 mA
Maximum supply voltage (Vsup)	4.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
Maximum disconnect time	400 ns
Maximum connection time	400 ns
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.4 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	1.8 mm

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