BG28F160C18B120 datasheet, PDF

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BG28F160C18B120: DescriptionFlash, 1MX16, 120ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55; Categorystorage storage; File Size2MB，52 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com

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BG28F160C18B120 Overview

Flash, 1MX16, 120ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55

BG28F160C18B120 Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	0.50 MM, CSP, MICRO, BGA-55
Contacts	55
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	120 ns
Other features	MINIMUM 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; BOTTOM BOOT BLOCK
startup block	BOTTOM
JESD-30 code	R-PBGA-B55
memory density	16777216 bi
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	55
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
type	NOR TYPE
Base Number Matches	1

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BG28F160C18B120 Related Products

	BG28F160C18B120	BG28F160C18T120	BG28F160C18T90	BG28F160C18B90
Description	Flash, 1MX16, 120ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55	Flash, 1MX16, 120ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55	Flash, 1MX16, 90ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55	Flash, 1MX16, 90ns, PBGA55, 0.50 MM, CSP, MICRO, BGA-55
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	0.50 MM, CSP, MICRO, BGA-55	0.50 MM, CSP, MICRO, BGA-55	0.50 MM, CSP, MICRO, BGA-55	0.50 MM, CSP, MICRO, BGA-55
Contacts	55	55	55	55
Reach Compliance Code	unknow	unknow	unknow	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	120 ns	90 ns	90 ns
Other features	MINIMUM 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; BOTTOM BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; TOP BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; TOP BOOT BLOCK	MINIMUM 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; BOTTOM BOOT BLOCK
startup block	BOTTOM	TOP	TOP	BOTTOM
JESD-30 code	R-PBGA-B55	R-PBGA-B55	R-PBGA-B55	R-PBGA-B55
memory density	16777216 bi	16777216 bi	16777216 bi	16777216 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16
Number of functions	1	1	1	1
Number of terminals	55	55	55	55
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Programming voltage	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
Base Number Matches	1	1	1	1

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