EEWORLDEEWORLDEEWORLD

Part Number

Search

HDSM2-200L0B6-0.5

Description
200 CONTACT(S), MALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, PLUG
CategoryThe connector    The connector   
File Size303KB,4 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

HDSM2-200L0B6-0.5 Overview

200 CONTACT(S), MALE, STRAIGHT TELECOM AND DATACOM CONNECTOR, SOLDER, PLUG

HDSM2-200L0B6-0.5 Parametric

Parameter NameAttribute value
MakerTE Connectivity
Reach Compliance Codeunknown
Other featuresSTANDRD: MIL-DTL-83513, POLARISED
Body/casing typePLUG
Connector typeTELECOM AND DATACOM CONNECTOR
Contact to complete cooperationGOLD (50) OVER COPPER
Contact completed and terminatedGOLD (50) OVER COPPER
Contact point genderMALE
DIN complianceNO
empty shellNO
Filter functionNO
IEC complianceNO
insulator materialLIQUID CRYSTAL POLYMER
JESD-609 codee4
MIL complianceYES
Manufacturer's serial numberHDSM
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD AND PANEL
OptionsGENERAL PURPOSE
Shell surfaceNICKEL
Shell materialALUMINUM ALLOY
Termination typeSOLDER
Total number of contacts200
Rectangular Connectors
High Density Standard Module (HDSM) Connectors
Features
I
Designed for surface
mounting on both daughter
board and mother board for
increased circuit density
Basic design offers 38, 78,
120, 152, 200, 304, and 400
contact designs
High reliability twist pin and
socket per MIL-DTL-83513
and MIL-DTL-55302
Connector permits lateral
movement of daughter
board to accommodate
clamping of the heatsink
Plated through-hole
mounting available
Available with flying leads
Extender card option
available
Typical mating force for 304
contacts is 38 pounds
Designed to withstand vapor
phase soldering
Two rotatable (six position)
polarizing keys are provided
accommodating 36 possible
combinations
Jackscrew hardware
available; consult
Tyco Electronics
Different modular inserts
may be specified to include
coax (Pixi/Con), fiber optic
or other special contacts
Inserts may be partially or
fully loaded and installed in
the connector shell in
various configurations
The MICRODOT HDSM
connector is designed for
4 row .050 [1.27] pitch
density with a special low
force twist pin that meets
all requirements of MIL-
DTL-55302 and MIL-DTL-
83513. This high density
connector allows the use of
construction to double the
packaging density with
surface mount capability.
I
I
I
Rectangular
Connectors
I
I
I
I
I
I
2
I
I
Performance Data Summary
Electrical
Contacts
— Pin 24 AWG twist pin,
Socket #24 AWG, Wire range 24 AWG to
32 AWG solid and stranded.
Contact Resistance (voltage drop)
25 millivolts max. at 3 amps, 25° ± 3° C.
Current Rating
— 3 amps max. per
contact
Dielectric Withstanding Voltage
Volts RMS 60 Hz at room ambient:
600 V for solder pots at sea level.
150 V for solder pots at 70,000 ft.
[21,336m]
500 V for wire terminations at sea level.
200 V for wire terminations at 70,000 ft.
Insulation Resistance
— 5,000
megohms min. at room ambient.
Magnetic Permeability
— 2 mµ max.
Materials and Finishes
Contacts
— Copper alloy plated with
.000050 [0.00127] gold over copper
flash per MIL-G-45204, Type II.
Metal Shell
Insulator — Liquid Crystal Polymer
(LCP) per ASTM D5138 or
Polyphenylene Sulfide per
MIL-M-24519
Body Shell — Aluminum alloy plated
Nickel, electroless per MIL-C-26074.
I
Environmental
Temperature Range
-67°F to 257°F [-55° C to +125° C].
Vibration
— No discontinuity in
excess of 1 micro sec. when tested in
accordance with MIL-STD-1344,
Method 2005, test Condition IV.
Insulator Retention
— Inserts will
withstand a 50 lb. per square inch load
in either direction.
Shock
— No discontinuity in excess of
1 micro sec. when tested in accordance
with MIL-STD-1344, Method 2004, test
Condition E.
Mechanical
Contact Spacing
— .050 [1.27] centers
Contact Engagement &
Separation
— 5.0 oz max. [1.39N]
(eng.) 0.5 oz. min. [.14N] 3.5 oz. typ.
[.97N] (sep.) force.
Durability
— No mechanical or electri-
cal defects detrimental to the function of
the connectors after 500 cycles of mat-
ing and unmating. (Caution: Mating
force increases during durability cycling
may be noted).
Humidity
— After exposure to humidi-
ty as specified by MIL-STD-1344,
Method 1002, Type II, IR shall be 1
megohm min. immediately following
step 7a of Method 1002 and 1000
megohms min. after 24 hours of condi-
tioning per Method 1002.
Salt Spray
— Connectors shall meet
the performance requirements of contact
resistance, mating and unmating forces,
and contact retention after being subject-
ed to the 48-hour 5% solution salt spray
test per MIL-STD-1344, Method 1001,
Condition B.
Crimp Termination Tensile
Strength
— *Unassembled contacts
with crimped stranded wire terminations.
Wires will not pull out of contacts when
the following axial loads are applied:
24 AWG, 5 lbs., 26 AWG, 4 lbs.,
28 AWG, 3 lbs.
51
Catalog 1308638
Revised 8-05
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
I saw NEC was having an event where they gave away development boards. How are you using them?
[i=s]This post was last edited by paulhyde on 2014-9-15 09:24[/i] I saw NEC was giving away development boards before. What were your thoughts or experiences when using them? I hope you can post pictu...
老夫子 Electronics Design Contest
WEBENCH User Manual and Design Tool Manual
It is very useful for learning the use and operation of WEBENCH tools. See the attachment for the content...
exiao Analogue and Mixed Signal
Use of DSP guidance function (zz)
TI's high-speed digital signal processor TMS320C6000 series DSP supports parallel processing and adopts a very long instruction word (VLIW) architecture. It has 8 functional units (two multipliers and...
程序天使 DSP and ARM Processors
Single chip microcomputer controlled thyristor
Can someone tell me the principle of single chip microcomputer controlling thyristor?...
liushiming82 51mcu
Download the practical information - Power Management Basics
Today’s highly integrated, configurable power management solutions offer built-in intelligence that greatly simplifies the design process by eliminating the need for external components. This reduces ...
石榴姐 RF/Wirelessly
I would like to ask you about the AD conversion problem
I would like to ask the experts, when I use the MSP430F133 microcontroller to implement AD conversion, after measuring the input voltage, the conversion result displayed by the program is inconsistent...
snailsun Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1726  197  2165  489  1337  35  4  44  10  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号