MSP430F122IRHBR datasheet, PDF

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MSP430F122IRHBR: Description16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，44 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430F122IRHBR Overview

16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85

MSP430F122IRHBR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Texas Instruments
Parts packaging code	QFN
package instruction	HVQCCN, LCC32,.2SQ,20
Contacts	32
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	1 week
Has ADC	YES
Address bus width
bit size	16
boundary scan	YES
CPU series	MSP430
maximum clock frequency	8 MHz
DAC channel	NO
DMA channel	NO
External data bus width
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PQCC-N32
JESD-609 code	e4
length	5 mm
low power mode	YES
Humidity sensitivity level	2
Number of DMA channels
Number of external interrupt devices
Number of I/O lines	22
Number of serial I/Os	1
Number of terminals	32
Number of timers	1
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC32,.2SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
RAM (bytes)	256
RAM (number of words)	0.25
rom(word)	4096
ROM programmability	FLASH
Maximum seat height	1 mm
speed	8 MHz
Maximum slew rate	0.35 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	1.8 V
Nominal supply voltage	2.2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC

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Description	16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, USART, Comparator 28-TSSOP -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, USART, Comparator 28-TSSOP -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 28-TSSOP -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 28-SOIC -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 4kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85	16-Bit Ultra-Low-Power Microcontroller, 8kB Flash, 256B RAM, USART, Comparator 32-VQFN -40 to 85
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	QFN	SSOP	SSOP	SSOP	SOIC	QFN	QFN	QFN
package instruction	HVQCCN, LCC32,.2SQ,20	TSSOP, TSSOP28,.25	TSSOP, TSSOP28,.25	TSSOP, TSSOP28,.25	SOP, SOP28,.4	HVQCCN, LCC32,.2SQ,20	HVQCCN, LCC32,.2SQ,20	HVQCCN, LCC32,.2SQ,20
Contacts	32	28	28	28	28	32	32	32
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compli	compli
Factory Lead Time	1 week	6 weeks	6 weeks	1 week	1 week	1 week	1 week	1 week
Has ADC	YES	YES	YES	YES	NO	YES	YES	YES
bit size	16	16	16	16	16	16	16	16
CPU series	MSP430	MSP430	MSP430	MSP430	MSP430	MSP430	MSP430	MSP430
maximum clock frequency	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 code	S-PQCC-N32	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	S-PQCC-N32	S-PQCC-N32	S-PQCC-N32
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4
length	5 mm	9.7 mm	9.7 mm	9.7 mm	17.9 mm	5 mm	5 mm	5 mm
Humidity sensitivity level	2	1	1	1	1	2	2	2
Number of I/O lines	22	22	22	22	22	22	22	22
Number of terminals	32	28	28	28	28	32	32	32
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	HVQCCN	TSSOP	TSSOP	TSSOP	SOP	HVQCCN	HVQCCN	HVQCCN
Encapsulate equivalent code	LCC32,.2SQ,20	TSSOP28,.25	TSSOP28,.25	TSSOP28,.25	SOP28,.4	LCC32,.2SQ,20	LCC32,.2SQ,20	LCC32,.2SQ,20
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256	256	256	256	256	256
rom(word)	4096	8192	8192	4096	4096	8192	4096	8192
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1 mm	1.2 mm	1.2 mm	1.2 mm	2.65 mm	1 mm	1 mm	1 mm
speed	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz	8 MHz
Maximum supply voltage	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V	2.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.5 mm	0.65 mm	0.65 mm	0.65 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	5 mm	4.4 mm	4.4 mm	4.4 mm	7.5 mm	5 mm	5 mm	5 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	Lead free	Lead free
boundary scan	YES	YES	YES	YES	-	YES	YES	YES
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	-	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	-	NO	NO	NO
low power mode	YES	YES	YES	YES	-	YES	YES	YES
Number of serial I/Os	1	1	1	1	-	1	1	1
Number of timers	1	1	1	1	-	1	1	1
On-chip data RAM width	8	8	8	8	-	8	8	8
On-chip program ROM width	8	8	8	8	-	8	8	8
RAM (number of words)	0.25	0.25	0.25	0.25	-	0.25	0.25	0.25
Maximum slew rate	0.35 mA	0.35 mA	0.35 mA	0.35 mA	-	0.35 mA	0.35 mA	0.35 mA

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