|
DS90CF366MTDX |
DS90CF386MTD |
| Description |
LVDS Interface IC |
+3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link - 85 MHz 56-TSSOP -10 to 70 |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
TSSOP |
TSSOP |
| package instruction |
TSSOP-48 |
TSSOP-56 |
| Contacts |
48 |
56 |
| Reach Compliance Code |
_compli |
_compli |
| ECCN code |
EAR99 |
EAR99 |
| Is Samacsys |
N |
N |
| Input properties |
DIFFERENTIAL |
DIFFERENTIAL |
| Interface integrated circuit type |
LINE RECEIVER |
LINE RECEIVER |
| Interface standards |
EIA-644; TIA-644 |
EIA-644; TIA-644 |
| JESD-30 code |
R-PDSO-G48 |
R-PDSO-G56 |
| JESD-609 code |
e0 |
e0 |
| length |
12.5 mm |
14 mm |
| Humidity sensitivity level |
2 |
2 |
| Number of functions |
4 |
4 |
| Number of terminals |
48 |
56 |
| Maximum operating temperature |
70 °C |
70 °C |
| Minimum operating temperature |
-10 °C |
-10 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
TSSOP |
TSSOP |
| Encapsulate equivalent code |
TSSOP48,.3,20 |
TSSOP56,.3,20 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) |
235 |
235 |
| power supply |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| Number of receiver bits |
3 |
4 |
| Maximum seat height |
1.1 mm |
1.1 mm |
| Maximum slew rate |
105 mA |
135 mA |
| Maximum supply voltage |
3.6 V |
3.6 V |
| Minimum supply voltage |
3 V |
3 V |
| Nominal supply voltage |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
COMMERCIAL |
COMMERCIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal pitch |
0.5 mm |
0.5 mm |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
6.1 mm |
6.1 mm |
| Base Number Matches |
1 |
1 |