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2-KS179-210TG

Description
IC Socket, PGA179, 179 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size179KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

2-KS179-210TG Overview

IC Socket, PGA179, 179 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

2-KS179-210TG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Reach Compliance Code_compli
ECCN codeEAR99
Other features2.5 OZ. AVG. INSERTION FORCE
body width1.8 inch
subject depth0.015 inch
body length1.8 inch
Contact structure18X18
Contact to complete cooperationAU ON NI
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA179
Shell materialPOLYAMIDE
JESD-609 codee0
Manufacturer's serial numberKS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts179
Maximum operating temperature400 °C
Minimum operating temperature-269 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
Page 34
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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Index Files: 2141  719  2651  1676  2190  44  15  54  34  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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