IC 3-CH 6-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQFP44, Analog to Digital Converter
| Parameter Name | Attribute value |
| Maker | NXP |
| package instruction | QFP, |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | S-PQFP-G44 |
| length | 10 mm |
| Maximum linear error (EL) | 0.9375% |
| Number of analog input channels | 3 |
| Number of digits | 6 |
| Number of functions | 1 |
| Number of terminals | 44 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output bit code | BINARY CODED DECIMAL |
| Output format | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Sampling rate | 35 MHz |
| Maximum seat height | 2.1 mm |
| Maximum slew rate | 80 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| width | 10 mm |
| TDA8707HGP | TDA8707HGPB | |
|---|---|---|
| Description | IC 3-CH 6-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQFP44, Analog to Digital Converter | IC 3-CH 6-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQFP44, Analog to Digital Converter |
| package instruction | QFP, | QFP, |
| Reach Compliance Code | unknown | unknown |
| ECCN code | EAR99 | EAR99 |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | S-PQFP-G44 | S-PQFP-G44 |
| length | 10 mm | 10 mm |
| Maximum linear error (EL) | 0.9375% | 0.9375% |
| Number of analog input channels | 3 | 3 |
| Number of digits | 6 | 6 |
| Number of functions | 1 | 1 |
| Number of terminals | 44 | 44 |
| Maximum operating temperature | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Output bit code | BINARY CODED DECIMAL | BINARY CODED DECIMAL |
| Output format | PARALLEL, WORD | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QFP | QFP |
| Package shape | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified |
| Sampling rate | 35 MHz | 35 MHz |
| Maximum seat height | 2.1 mm | 2.1 mm |
| Maximum slew rate | 80 mA | 80 mA |
| Nominal supply voltage | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING |
| Terminal pitch | 0.8 mm | 0.8 mm |
| Terminal location | QUAD | QUAD |
| width | 10 mm | 10 mm |