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MC10EPT20DT

Description
TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, TSSOP-8
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size810KB,11 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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MC10EPT20DT Overview

TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, TSSOP-8

MC10EPT20DT Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeSOIC
package instructionPLASTIC, TSSOP-8
Contacts8
Reach Compliance Codeunknown
maximum delay0.45 ns
Interface integrated circuit typeTTL/CMOS TO PECL TRANSLATOR
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
Humidity sensitivity levelNOT SPECIFIED
Number of digits1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output latch or registerNONE
Output polarityCOMPLEMENTARY
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height1.1 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyECL
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm

MC10EPT20DT Preview

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MC10EPT20, MC100EPT20
3.3V LVTTL/LVCMOS to
Differential LVPECL
Translator
The MC10EPT20 is a 3.3 V TTL/CMOS to differential PECL
translator. Because PECL (Positive ECL) levels are used, only +3.3 V
and ground are required. The small outline SOIC−8 package and the
single gate of the EPT20 makes it ideal for those applications where
space, performance, and low power are at a premium.
The 100 Series contains temperature compensation.
Features
8
1
SO−8
D SUFFIX
CASE 751
1
http://onsemi.com
MARKING DIAGRAMS*
8
HPT20
ALYW
G
8
KPT20
ALYW
G
390 ps Typical Propagation Delay
Maximum Input Clock Frequency > 1 GHz Typical
Operating Range V
CC
= 3.0 V to 3.6 V
with GND = 0 V
PNP TTL Input for Minimal Loading
Q Output will Default HIGH with Input Open
Pb−Free Packages are Available
1
8
1
TSSOP−8
DT SUFFIX
CASE 948R
8
HA20
ALYWG
G
8
KA20
ALYWG
G
1
1
DFN8
MN SUFFIX
CASE 506AA
1
5W MG
G
4
1
H
K
5W
3Q
M
= MC10
= MC100
= MC10
= MC100
= Date Code
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
©
Semiconductor Components Industries, LLC, 2008
August, 2008
Rev. 11
1
Publication Order Number:
MC10EPT20/D
3Q MG
G
4
MC10EPT20, MC100EPT20
Table 1. PIN DESCRIPTION
NC
1
8
V
CC
PIN
Q, Q
Q
2
LVTTL
7
D
D
V
CC
GND
Q
3
LVPECL
6
NC
NC
EP
FUNCTION
Differential PECL Outputs
LVTTL Input
Positive Supply
Ground
No Connect
(DFN8 only) Thermal exposed
pad must be connected to a suffi-
cient thermal conduit. Electrically
connect to the most negative sup-
ply (GND) or leave unconnected,
floating open.
NC
4
5
GND
Figure 1. 8−Lead Pinout
(Top View)
and Logic Diagram
Table 2. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Value
N/A
N/A
> 1.5 kV
> 200 V
> 2 kV
Level 1
UL 94 V−0 @ 0.125 in
150 Devices
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Oxygen Index: 28 to 34
http://onsemi.com
2
MC10EPT20, MC100EPT20
Table 3. MAXIMUM RATINGS
Symbol
V
CC
V
I
I
out
TA
T
stg
q
JA
q
JC
q
JA
q
JC
q
JA
T
sol
q
JC
Power Supply
Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Pb
Pb−Free
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
DFN8
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
Parameter
Condition 1
GND = 0 V
GND = 0 V
Continuous
Surge
V
I

V
CC
Condition 2
Rating
6
6
50
100
−40
to +85
−65
to +150
190
130
41 to 44
185
140
41 to 44
129
84
265
265
35 to 40
Unit
V
V
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C/W
Thermal Resistance (Junction−to−Case)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board
2S2P (2 signal, 2 power)
http://onsemi.com
3
MC10EPT20, MC100EPT20
Table 4. LVTTL INPUT DC CHARACTERISTICS
V
CC
= 3.3 V, GND = 0 V, T
A
=
−40°C
to +85°C
Symbol
I
IH
I
IHH
I
IL
V
IK
V
IH
V
IL
Characteristic
Input HIGH Current (V
in
= 2.7 V)
Input HIGH Current MAX (V
in
= 6.0 V)
Input LOW Current (V
in
= 0.5 V)
Input Clamp Voltage (I
in
=
−18
mA)
Input HIGH Voltage
Input LOW Voltage
2.0
0.8
Min
Typ
Max
20
100
−0.6
−1.2
Unit
mA
mA
mA
V
V
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 5. 10EPT PECL OUTPUT DC CHARACTERISTICS
V
CC
= 3.3 V, GND = 0 V (Note 3)
−40°C
Symbol
I
CC
V
OH
V
OL
Characteristic
Positive Power Supply Current
Output HIGH Voltage (Note 4)
Output LOW Voltage (Note 4)
Min
18
2165
1365
Typ
23
2290
1490
Max
28
2415
1615
Min
18
2230
1430
25°C
Typ
23
2355
1555
Max
28
2480
1680
Min
19
2290
1490
85°C
Typ
24
2415
1615
Max
29
2540
1740
Unit
mA
mV
mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Output parameters vary 1:1 with V
CC
.
4. All loading with 50
W
to V
CC
2.0 V.
http://onsemi.com
4

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Description TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, TSSOP-8 TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, SOIC-8 TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, SOIC-8 TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, TSSOP-8 TTL/CMOS TO PECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO8, PLASTIC, SOIC-8
Is it lead-free? Contains lead Lead free Contains lead Contains lead Lead free
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code SOIC SOIC SOIC SOIC SOIC
package instruction PLASTIC, TSSOP-8 PLASTIC, SOIC-8 PLASTIC, SOIC-8 PLASTIC, TSSOP-8 PLASTIC, SOIC-8
Contacts 8 8 8 8 8
Reach Compliance Code unknown unknown unknown unknown unknown
maximum delay 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns
Interface integrated circuit type TTL/CMOS TO PECL TRANSLATOR TTL/CMOS TO PECL TRANSLATOR TTL/CMOS TO PECL TRANSLATOR TTL/CMOS TO PECL TRANSLATOR TTL/CMOS TO PECL TRANSLATOR
JESD-30 code S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 S-PDSO-G8 R-PDSO-G8
JESD-609 code e0 e0 e0 e0 e0
length 3 mm 4.9 mm 4.9 mm 3 mm 4.9 mm
Humidity sensitivity level NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Number of digits 1 1 1 1 1
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
Output latch or register NONE NONE NONE NONE NONE
Output polarity COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP SOP TSSOP SOP
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) 240 240 240 240 240
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.1 mm 1.75 mm 1.75 mm 1.1 mm 1.75 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES
technology ECL ECL ECL ECL ECL
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30
width 3 mm 3.9 mm 3.9 mm 3 mm 3.9 mm
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