|
BA582T1 |
BA582T3 |
| Description |
35V, SILICON, PIN DIODE |
35V, SILICON, PIN DIODE |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Motorola ( NXP ) |
Motorola ( NXP ) |
| package instruction |
R-PDSO-G2 |
R-PDSO-G2 |
| Reach Compliance Code |
unknown |
unknown |
| ECCN code |
EAR99 |
EAR99 |
| application |
SWITCHING |
SWITCHING |
| Minimum breakdown voltage |
35 V |
35 V |
| Configuration |
SINGLE |
SINGLE |
| Maximum diode capacitance |
1.4 pF |
1.4 pF |
| Nominal diode capacitance |
1.4 pF |
1.4 pF |
| Diode component materials |
SILICON |
SILICON |
| Maximum diode forward resistance |
0.5 Ω |
0.5 Ω |
| Diode resistance test current |
3 mA |
3 mA |
| Diode resistance test frequency |
100 MHz |
100 MHz |
| Diode type |
PIN DIODE |
PIN DIODE |
| frequency band |
VERY HIGH FREQUENCY |
VERY HIGH FREQUENCY |
| JESD-30 code |
R-PDSO-G2 |
R-PDSO-G2 |
| JESD-609 code |
e0 |
e0 |
| Number of components |
1 |
1 |
| Number of terminals |
2 |
2 |
| Maximum operating temperature |
125 °C |
125 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| Package shape |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
| Maximum power dissipation |
0.2 W |
0.2 W |
| Certification status |
Not Qualified |
Not Qualified |
| Reverse test voltage |
20 V |
20 V |
| surface mount |
YES |
YES |
| technology |
POSITIVE-INTRINSIC-NEGATIVE |
POSITIVE-INTRINSIC-NEGATIVE |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
GULL WING |
GULL WING |
| Terminal location |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| Base Number Matches |
1 |
1 |