|
SM320C6455BGTZSEP |
SM320C6455BGTZEP |
| Description |
Enhanced Product Fixed-Point Digital Signal Processor 697-FCBGA -55 to 105 |
Enhanced Product Fixed-Point Digital Signal Processor 697-FCBGA 0 to 90 |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
BGA |
BGA |
| package instruction |
HFBGA, BGA697,29X29,32 |
HFBGA, BGA697,29X29,32 |
| Contacts |
697 |
697 |
| Reach Compliance Code |
_compli |
_compli |
| ECCN code |
3A991.A.2 |
3A991.A.2 |
| Factory Lead Time |
6 weeks |
1 week |
| Other features |
IT ALSO REQUIRES 3.3V I/O SUPPLY |
IT ALSO REQUIRES 3.3V I/O SUPPLY |
| Address bus width |
20 |
20 |
| barrel shifter |
NO |
NO |
| bit size |
32 |
32 |
| boundary scan |
YES |
YES |
| maximum clock frequency |
66.6 MHz |
66.6 MHz |
| External data bus width |
64 |
64 |
| Format |
FIXED POINT |
FIXED POINT |
| Integrated cache |
YES |
YES |
| Internal bus architecture |
MULTIPLE |
MULTIPLE |
| JESD-30 code |
S-PBGA-B697 |
S-PBGA-B697 |
| JESD-609 code |
e0 |
e0 |
| length |
24 mm |
24 mm |
| low power mode |
YES |
YES |
| Humidity sensitivity level |
4 |
4 |
| Number of DMA channels |
64 |
64 |
| Number of terminals |
697 |
697 |
| Number of timers |
4 |
4 |
| On-chip program ROM width |
8 |
8 |
| Maximum operating temperature |
105 °C |
90 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HFBGA |
HFBGA |
| Encapsulate equivalent code |
BGA697,29X29,32 |
BGA697,29X29,32 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
GRID ARRAY, HEAT SINK/SLUG, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
220 |
220 |
| power supply |
1.2,1.8,3.3 V |
1.2,1.8,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| RAM (number of words) |
32768 |
32768 |
| ROM programmability |
MROM |
MROM |
| Maximum seat height |
3.1 mm |
3.1 mm |
| Maximum supply voltage |
1.2875 V |
1.2875 V |
| Minimum supply voltage |
1.2125 V |
1.2125 V |
| Nominal supply voltage |
1.25 V |
1.25 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
OTHER |
OTHER |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
BALL |
BALL |
| Terminal pitch |
0.8 mm |
0.8 mm |
| Terminal location |
BOTTOM |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
24 mm |
24 mm |
| uPs/uCs/peripheral integrated circuit type |
DIGITAL SIGNAL PROCESSOR, OTHER |
DIGITAL SIGNAL PROCESSOR, OTHER |