Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| package instruction | PGA, |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.1.A |
| Maximum access time | 90 ns |
| Other features | USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN |
| JESD-30 code | S-CPGA-P66 |
| JESD-609 code | e4 |
| length | 30.1 mm |
| memory density | 67108864 bit |
| Memory IC Type | FLASH MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 66 |
| word count | 8388608 words |
| character code | 8000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 8MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 6.22 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | GOLD |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 30.1 mm |
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