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WED3DG728V10D1

Description
Synchronous DRAM Module, 8MX72, CMOS, SODIMM-144
Categorystorage    storage   
File Size228KB,6 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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WED3DG728V10D1 Overview

Synchronous DRAM Module, 8MX72, CMOS, SODIMM-144

WED3DG728V10D1 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeSODIMM
package instructionDIMM,
Contacts144
Reach Compliance Codecompliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XZMA-N144
memory density603979776 bit
Memory IC TypeSYNCHRONOUS DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals144
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize8MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationZIG-ZAG
Maximum time at peak reflow temperatureNOT SPECIFIED

WED3DG728V10D1 Preview

White Electronic Designs
64MB – 8Mx72 SDRAM UNBUFFERED
FEATURES
Burst Mode Operation
Auto and Self Refresh capability
LVTTL compatible inputs and outputs
Serial Presence Detect with EEPROM
Fully synchronous: All signals are registered on the
positive edge of the system clock
Programmable Burst Lengths: 1, 2, 4, 8 or Full
Page
3.3V ± 0.3V Power Supply
144 Pin SO-DIMM
• PCB height: 27.94mm (1.10")
WED3DG728V-D1
ADVANCED*
DESCRIPTION
The WED3DG728V is a 8Mx72 synchronous DRAM
module which consists of nine 8Mx8 SDRAM components
in TSOP II package, and one 2Kb EEPROM in an 8
pin TSOP package for Serial Presence Detect which
are mounted on a 144 pin SO-DIMM multilayer FR4
Substrate.
* This product is under development, is not qualified or characterized and is subject to
change or cancellation without notice.
NOTE: Consult factory for availability of:
• RoHS compliant products
• Vendor source control options
• Industrial temperature option
PIN CONFIGURATIONS (FRONT SIDE/BACK SIDE)
PINOUT
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
FRONT
V
SS
DQ0
DQ1
DQ2
DQ3
V
CC
DQ4
DQ5
DQ6
DQ7
V
SS
DQMB0
DQMB1
V
CC
A0
A1
A2
V
SS
DQ8
DQ9
DQ10
DQ11
V
CC
DQ12
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
BACK
V
SS
DQ32
DQ33
DQ34
DQ35
V
CC
DQ36
DQ37
DQ38
DQ39
V
SS
DQMB4
DQMB5
V
CC
A3
A4
A5
V
SS
DQ40
DQ41
DQ42
DQ43
V
CC
DQ44
PIN
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
FRONT
DQ13
DQ14
DQ15
V
SS
CB0
CB1
CLK0
V
CC
RAS#
WE#
SO#
NC
NC
V
SS
CB2
CB3
V
CC
DQ16
DQ17
DQ18
DQ19
V
SS
DQ20
DQ21
PIN
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
BACK
DQ45
DQ46
DQ47
V
SS
CB4
CB5
CKE0
V
CC
CAS#
NC
NC
NC
CK1
V
SS
CB6
CB7
V
CC
DQ48
DQ49
DQ50
DQ51
V
SS
DQ52
DQ53
PIN
97
99
101
103
105
107
109
111
113
115
117
119
121
123
125
127
129
131
133
135
137
139
141
143
FRONT
DQ22
DQ23
V
CC
A6
A8
V
SS
A9
A10
V
CC
DQMB2
DQMB3
V
SS
DQ24
DQ25
DQ26
DQ27
V
CC
DQ28
DQ29
DQ30
DQ31
V
SS
SDA
V
CC
PIN
98
100
102
104
106
108
110
112
114
116
118
120
122
124
126
128
130
132
134
136
138
140
142
144
BACK
DQ54
DQ55
DQ55
A7
BA0
V
SS
BA1
A11
V
CC
DQMB6
DQMB7
V
SS
DQ56
DQ57
DQ58
DQ59
V
CC
DQ60
DQ61
DQ62
DQ63
V
SS
SCL
V
CC
PIN NAMES
A0 – A11
BA0-1
DQ0-63
CB0-7
CLK0,CLK1
CKE0
CS0#
RAS#
CAS#
WE#
DQMB0-7
V
CC
V
SS
SDA
SCL
NC
Address Input (Multiplexed)
Select Bank
Data Input/Output
Check Bit (Data-In/Data-Out)
Clock Input
Clock Enable Input
Chip Select Input
Row Address Strobe
Column Address Strobe
Write Enable
DQM
Power Supply (3.3V)
Ground
Serial Data I/O
Serial Clock
No Connect
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 0
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
FUNCTIONAL BLOCK DIAGRAM
WE#
S0#
DQMB0
DQM
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQMB1
DQM
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
DQMB6
DQM
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
DQMB2
DQM
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQMB3
DQM
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
WE#
*CLOCK WIRING
CLOCK
SDRAMS
INPUT
*CLK0
4 0R 5 SDRAMS
4 0R 5 SDRAMS
*CLK1
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
WE#
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
DQMB7
DQM
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
S0#
WE#
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQM
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
S0#
WE#
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
WE#
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQMB5
DQM
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
DQMB4
DQM
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
S0#
WED3DG728V-D1
ADVANCED
WE#
WE#
WE#
WE#
SERIAL PD
SCL
A0
A1
A2
SDA
RAS#
CAS#
CKE0
BA0-BA1
A0-A11
RAS#: SDRAM
CAS#: SDRAM
CKE0: SDRAM
BA0-BA1: SDRAM
A0-A11: SDRAM
V
CC
V
SS
SDRAM
SDRAM
NOTE: DQ wiring may differ than described in this drawing, however DQ/DQMB/
CKE/S relationships must be maintianed as shown.
All resister values are 22 ohms ±5% unless otherwise specified.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 0
2
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on any pin relative to V
SS
Voltage on V
CC
supply relative to V
SS
Storage Temperature
Power Dissipation
Short Circuit Current
Symbol
V
IN
, V
OUT
V
CC
, V
CCQ
T
STG
P
D
I
OS
Value
WED3DG728V-D1
ADVANCED
Units
V
V
°C
W
mA
-1.0 ~ 4.6
-1.0 ~ 4.6
-55 ~ +150
9
50
Note: Permanent device damage may occur if “ABSOLUTE MAXIMUM RATINGS” are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
RECOMMENDED DC OPERATING CONDITIONS
Voltage Referenced to: V
SS
= 0V, 0°C
T
A
+70°C
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Input Leakage Current
Symbol
V
CC
V
IH
V
IL
V
OH
V
OL
I
LI
Min
3.0
2.0
-0.3
2.4
-10
Typ
3.3
3.0
Max
3.6
V
CCQ
+0.3
0.8
0.4
10
Unit
V
V
V
V
V
μA
1
2
I
OH
= -2mA
I
OL
= -2mA
3
Note
Note:
1. V
IH
(max)= 5.6V AC. The overshoot voltage duration is
3ns.
2. V
IL
(min)= -2.0V AC. The undershoot voltage duration is
3ns.
3. Any input 0V
V
IN
V
CCQ
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
T
A
= 25°C, f = 1MHz, V
CC
= 3.3V, V
REF
= 1.4V ± 200mV
Parameter
Input Capacitance (A0-A11)
Input Capacitance (RAS#,CAS#,WE#)
Input Capacitance (CKE0)
Input Capacitance (CLK0)
Input Capacitance (CS0#)
Input Capacitance (DQM0-DQM7)
Input Capacitance (BA0-BA1)
Data Input/Output Capacitance (DQ0-DQ63)
Data Input/Output Capacitance (CB0-7)
Symbol
C
IN1
C
IN2
C
IN3
C
IN4
C
IN5
C
IN6
C
IN7
C
OUT
C
OUT1
Max
15
15
15
20
15
15
15
22
22
Unit
pF
pF
pF
pF
pF
pF
pF
pF
pF
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 0
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
OPERATING CURRENT CHARACTERISTICS
V
CC
= 3.3V, 0°C
T
A
+70°C
WED3DG728V-D1
ADVANCED
Version
Parameter
Operating Current
(One bank active)
Precharge Standby Current
in Power Down Mode
Active Standby Current in
Non-Power Down Mode
Operating Current (Burst mode)
Refresh Current
Self Refresh Current
Notes:
1. Measured with outputs open.
2. Refresh period is 64ms.
Symbol
I
CC1
Conditions
Burst Length = 1
t
RC
t
RC
(min)
I
OL
= 0mA
CKE
V
IL
(max), t
CC
= 10ns
CKE
V
IH
(min), CS
V
IH
(min), tcc = 10ns Input
signals are changed one time during 20ns
Io = mA
Page burst
4 Banks activated
t
CCD
= 2CK
t
RC
t
RC
(min)
CKE
0.2V
133
1,080
100
990
Units
mA
Note
1
I
CC2
I
CC3
I
CC4
20
50
mA
mA
1,350
1,800
20
1,170
1,710
mA
mA
mA
1
2
I
CC5
I
CC6
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 0
4
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
ORDERING INFORMATION FOR D1
Part Number
WED3DG728V10D1
WED3DG728V7D1
WED3DG728V75D1
Speed
100MHz
133MHz
133MHz
CAS Latency
CL=2
CL=2
CL=3
WED3DG728V-D1
ADVANCED
Height
27.94 (1.10”)
27.94 (1.10”)
27.94 (1.10”)
NOTES:
• Consult Factory for availability of RoHS compliant products. (G = RoHS Compliant)
• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to be
replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option
PACKAGE DIMENSIONS FOR D1
67.72
(2.661 Max)
2.01 (0.079 Min)
3.81
(0.150)
MAX.
3.99
(0.157)
27.94
(1.10)
Max
19.99
(0.787)
23.14
(0.913)
28.2
(1.112)
32.79
(1.291)
4.60 (0.181)
1.50 (0.059)
0.99
(0.039)
(± 0.004)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October 2005
Rev. 0
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WED3DG728V10D1 Related Products

WED3DG728V10D1 WED3DG728V10D1G WED3DG728V7D1 WED3DG728V7D1G WED3DG728V75D1 WED3DG728V75D1G
Description Synchronous DRAM Module, 8MX72, CMOS, SODIMM-144 Synchronous DRAM Module, 8MX8, CMOS, ROHS COMPLIANT, SODIMM-144 Synchronous DRAM Module, 8MX72, CMOS, SODIMM-144 Synchronous DRAM Module, 8MX8, CMOS, ROHS COMPLIANT, SODIMM-144 Synchronous DRAM Module, 8MX72, CMOS, SODIMM-144 Synchronous DRAM Module, 8MX8, CMOS, ROHS COMPLIANT, SODIMM-144
Is it lead-free? Contains lead Lead free Contains lead Lead free Contains lead Lead free
Is it Rohs certified? incompatible conform to incompatible conform to incompatible conform to
Maker Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi
Parts packaging code SODIMM MODULE SODIMM MODULE SODIMM MODULE
package instruction DIMM, DIMM, DIMM, DIMM, DIMM, DIMM,
Contacts 144 144 144 144 144 144
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST DUAL BANK PAGE BURST FOUR BANK PAGE BURST DUAL BANK PAGE BURST FOUR BANK PAGE BURST DUAL BANK PAGE BURST
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH; LG-MAX; WD-MAX AUTO/SELF REFRESH AUTO/SELF REFRESH; LG-MAX; WD-MAX AUTO/SELF REFRESH AUTO/SELF REFRESH; LG-MAX; WD-MAX
JESD-30 code R-XZMA-N144 R-XDMA-N144 R-XZMA-N144 R-XDMA-N144 R-XZMA-N144 R-XDMA-N144
memory density 603979776 bit 67108864 bit 603979776 bit 67108864 bit 603979776 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
memory width 72 8 72 8 72 8
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 144 144 144 144 144 144
word count 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words 8388608 words
character code 8000000 8000000 8000000 8000000 8000000 8000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 8MX72 8MX8 8MX72 8MX8 8MX72 8MX8
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM DIMM DIMM DIMM
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
self refresh YES YES YES YES YES YES
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location ZIG-ZAG DUAL ZIG-ZAG DUAL ZIG-ZAG DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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