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SM5470-030-G-B

Description
Low Cost Packaged Pressure Sensors
File Size283KB,4 Pages
ManufacturerETC2
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SM5470-030-G-B Overview

Low Cost Packaged Pressure Sensors

SILICON
MICROSTRUCTURES
INCORPORATED
SM5430/SM5470
Low Cost Packaged Pressure Sensors
S
URFACE
M
OUNT AND
DIP P
RESSURE
S
ENSORS
L
OW
-
COST PACKAGED DIE
DESCRIPTION
Silicon Microstructures provides its two most
popular pressure sensor die in surface
mount dual in-line package (SO-16)
configuration. All parts in these series are
uncompensated high-performance die
mounted in an injection-molded package
designed for surface mounting.
These packaged sensor die provide a way
for OEM manufacturers to incorporate
pressure sensors at costs close to raw die
prices, without the need to handle, attach, or
wire bond silicon sensor die.
Options include pressure range, absolute or
gage configuration, and a choice of cap
configurations. The result is a versatile
product line suitable for a wide range or
OEM applications.
The low-pressure series (model
SM5470)
incorporate Silicon Microstructures unique
low-pressure die to achieve high
performance in pressure ranges from 0.15
PSI full-scale to 3 PSI full-scale in gauge
and differential configuration.
The model
SM5430
comes in gauge,
differential, and absolute versions for
pressure ranges from 5 PSI to 100 PSI.
FEATURES
Low pressure (from 0-0.15 to 0-100 PSI
FS)
Easy to Use
Compact and Light-weight
High-performance, Stable Silicon Chip
and Package
Easily Embedded in OEM Equipment
High-volume, Low Cost
APPLICATIONS
Altimeters
Barometric Correction
Tire Gauges
Digital Pressure Gauges
Environmental Monitoring
Appliances
Consumer and Sports
HVAC
Medical Instrumentation and Monitoring
Pressure Differential and Flow
Monitoring
Hand-held Gauges
Rev 1.3 07_06
2004-2006
Silicon Microstructures, Inc.
1701 McCarthy Blvd.
Milpitas, CA 95035 USA
Tel: 408-577-0100
Fax: 408-577-0123
sales@si-micro.com
www.si-micro.com
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