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DL5929A-TP

Description
Zener Diode, 15V V(Z), 10%, 1.5W, Silicon, Unidirectional, GLASS, MELF-2
CategoryDiscrete semiconductor    diode   
File Size174KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

DL5929A-TP Overview

Zener Diode, 15V V(Z), 10%, 1.5W, Silicon, Unidirectional, GLASS, MELF-2

DL5929A-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionGLASS, MELF-2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee3
Number of components1
Number of terminals2
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation1.5 W
Certification statusNot Qualified
Nominal reference voltage15 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance10%
Working test current25 mA
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
DL5918B
THRU
DL5942B
1.5 Watt
Zener Diode
5.1 to 51 Volts
Features
Wide Voltage Range Available
Glass Package
High Temp Soldering: 260°C for 10 Seconds At Terminals
Marking : Cathode band.
Moisture Sensitivity Level 1
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
1.5 Watt DC Power Dissipation
Power Derating: 20 mW/°C above 75°C
Forward Voltage @ 200mA: 1.2 Volts
Figure 1 - Typical Capacitance
100
At zero volts
C
MELF
Cathode Mark
At –2 Volts V
R
pf
B
10
A
1
0
100
V
Z
DIMENSIONS
200
DIM
A
B
C
Typical Capacitance (pf) –
versus
– Zener voltage (V
Z
)
Figure 2 - Derating Curve
INCHES
MIN
.190
---
.095
MAX
.205
.022
.105
MM
MIN
4.80
---
2.40
MAX
5.20
.55
2.67
NOTE
Nominal
2.0
SUGGESTED SOLDER
PAD LAYOUT
.220”
W
1.0
.115”
50
100
150
Temperature
°C
Power Dissipation (W) -
Versus
-
Ambient
Temperature
°C
0
.035”
www.mccsemi.com
Revision:
A
1 of 3
2011/01/01
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