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MAX3002EBP

Description
Interface Circuit, BICMOS, PBGA20, UCSP-20
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size213KB,25 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
Download Datasheet Parametric Compare View All

MAX3002EBP Overview

Interface Circuit, BICMOS, PBGA20, UCSP-20

MAX3002EBP Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMaxim
package instructionUCSP-20
Reach Compliance Codenot_compliant
ECCN codeEAR99
Factory Lead Time1 week
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeR-PBGA-B20
JESD-609 codee0
length2.54 mm
Humidity sensitivity level1
Number of functions1
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height0.67 mm
Maximum supply voltage5.5 V
Minimum supply voltage1.2 V
Supply voltage 1-max5.5 V
Mains voltage 1-minute1.65 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width2.03 mm
19-2672; Rev 5; 8/08
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
General Description
The MAX3000E/MAX3001E/MAX3002–MAX3012
8-channel level translators provide the level shifting nec-
essary to allow data transfer in a multivoltage system.
Externally applied voltages, V
CC
and V
L
, set the logic lev-
els on either side of the device. Logic signals present on
the V
L
side of the device appear as a higher voltage logic
signal on the V
CC
side of the device, and vice-versa.
The MAX3000E/MAX3001E/MAX3002/MAX3003 use an
architecture specifically designed to be bidirectional
without the use of a directional pin.
The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012
feature an EN input that, when low, reduces the V
CC
and
V
L
supply currents to < 2µA. The MAX3000E/MAX3001E
also have ±15kV ESD protection on the I/O V
CC
side for
greater protection in applications that route signals
externally. The MAX3000E operates at a guaranteed data
rate of 230kbps. The MAX3001E operates at a guaranteed
data rate of 4Mbps. The MAX3002–MAX3012 operate at a
guaranteed data rate of 20Mbps over the entire specified
operating voltage range.
The MAX3000E/MAX3001E/MAX3002–MAX3012 accept
V
L
voltages from +1.2V to +5.5V and V
CC
voltages from
+1.65V to +5.5V, making them ideal for data transfer
between low-voltage ASICs/PLDs and higher voltage
systems. The MAX3000E/MAX3001E/MAX3002–
MAX3012 are available in 20-bump UCSP™, 20-pin
TQFN (5mm x 5mm), and 20-pin TSSOP packages.
Features
Guaranteed Data Rate Options
230kbps (MAX3000E)
4Mbps (MAX3001E)
20Mbps (MAX3002–MAX3012)
Bidirectional Level Translation Without Using a
Directional Pin (MAX3000E/MAX3001E/MAX3002/
MAX3003)
Unidirectional Level Translation
(MAX3004–MAX3012)
Operation Down to +1.2V on V
L
±15kV ESD Protection on I/O V
CC
Lines
(MAX3000E/MAX3001E)
Ultra-Low 0.1µA Supply Current in Shutdown
Low Quiescent Current (< 10µA)
UCSP, TQFN, and TSSOP Packages
MAX3000E/MAX3001E/MAX3002–MAX3012
Ordering Information
PART
MAX3000EEUP
MAX3000EEBP-T
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
20 TSSOP
4 x 5 UCSP
Ordering Information continued at end of data sheet.
Note:
All devices operate over the -40°C to +85°C operating
temperature range.
Applications
CMOS Logic-Level Translation
Cellphones
SPI™ and MICROWIRE™ Level Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cellphone Cradles
Portable POS Systems
Portable Communication Devices
Low-Cost Serial Interfaces
GPS
DATA
+1.8V
SYSTEM
CONTROLLER
+1.8V
Typical Operating Circuit
+3.3V
V
L
EN
V
CC
MAX3000E
MAX3001E
MAX3002–
MAX3012
I/O V
CC_
+3.3V
SYSTEM
Telecommunications Equipment
UCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor.
I/O V
L_
DATA
GND
Pin Configurations and Functional Diagrams appear at end
of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX3002EBP Related Products

MAX3002EBP MAX3001EEBP MAX3006EBP MAX3010EBP MAX3000EEBP MAX3002EBP+
Description Interface Circuit, BICMOS, PBGA20, UCSP-20 Interface Circuit, BICMOS, PBGA20 Interface Circuit, BICMOS, 5 X 4 MM, UCSP-20 Interface Circuit, BICMOS, 5 X 4 MM, UCSP-20 Interface Circuit, BICMOS, PBGA20 Interface Circuit, BICMOS, PBGA20, UCSP-20
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible conform to
Reach Compliance Code not_compliant _compli not_compliant not_compliant not_compliant compliant
JESD-30 code R-PBGA-B20 R-PBGA-B20 R-XBGA-B20 R-XBGA-B20 R-PBGA-B20 R-PBGA-B20
Number of terminals 20 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code VFBGA FBGA VFBGA VFBGA FBGA VFBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL BALL BALL BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead -
Maker Maxim - Maxim Maxim Maxim Maxim
package instruction UCSP-20 - 5 X 4 MM, UCSP-20 5 X 4 MM, UCSP-20 - VFBGA,
Interface integrated circuit type INTERFACE CIRCUIT - INTERFACE CIRCUIT INTERFACE CIRCUIT - INTERFACE CIRCUIT
JESD-609 code e0 e0 e0 e0 - e1
Humidity sensitivity level 1 1 1 1 - 1
Number of functions 1 - 8 8 - 1
Maximum seat height 0.67 mm - 0.67 mm 0.67 mm - 0.67 mm
Maximum supply voltage 5.5 V - 5.5 V 5.5 V - 5.5 V
Minimum supply voltage 1.2 V - 1.2 V 1.2 V - 1.2 V
Terminal surface Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) - Tin/Silver/Copper (Sn/Ag/Cu)
Encapsulate equivalent code - BGA20,4X5,20 BGA20,4X5,20 BGA20,4X5,20 BGA20,4X5,20 -
power supply - 1.8/5 V 1.8/5 V 1.8/5 V 1.8/5 V -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified -

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