DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, BGA8, WCSP-8
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | WCSP-8 |
| Contacts | 8 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-XBGA-B8 |
| length | 1.9 mm |
| normal position | NO/NC |
| Number of channels | 1 |
| Number of functions | 2 |
| Number of terminals | 8 |
| Nominal off-state isolation | 62 dB |
| On-state resistance matching specifications | 0.04 Ω |
| Maximum on-state resistance (Ron) | 3.9 Ω |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| output | SEPARATE OUTPUT |
| Package body material | UNSPECIFIED |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA8,2X4,20 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| power supply | 1.8/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.5 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| Maximum disconnect time | 15.5 ns |
| Maximum connection time | 18 ns |
| switch | BREAK-BEFORE-MAKE |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| width | 0.9 mm |