OT PLD, 9ns, PLS-Type, TTL, PDIP28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP28,.3 |
| Reach Compliance Code | unknown |
| Architecture | PLS-TYPE |
| maximum clock frequency | 31.3 MHz |
| JESD-30 code | R-PDIP-T28 |
| JESD-609 code | e0 |
| Number of entries | 16 |
| Output times | 8 |
| Number of product terms | 48 |
| Number of terminals | 28 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Programmable logic type | OT PLD |
| propagation delay | 9 ns |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| PLUS105-45N3 | PLUS105-45A | PLUS105-45N | |
|---|---|---|---|
| Description | OT PLD, 9ns, PLS-Type, TTL, PDIP28, | OT PLD, 9ns, PLS-Type, TTL, PQCC28, | OT PLD, 9ns, PLS-Type, TTL, PDIP28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | unknown | unknown |
| Architecture | PLS-TYPE | PLS-TYPE | PLS-TYPE |
| maximum clock frequency | 31.3 MHz | 31.3 MHz | 31.3 MHz |
| JESD-30 code | R-PDIP-T28 | S-PQCC-J28 | R-PDIP-T28 |
| JESD-609 code | e0 | e0 | e0 |
| Number of entries | 16 | 16 | 16 |
| Output times | 8 | 8 | 8 |
| Number of product terms | 48 | 48 | 48 |
| Number of terminals | 28 | 28 | 28 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | DIP |
| Encapsulate equivalent code | DIP28,.3 | LDCC28,.5SQ | DIP28,.6 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD |
| propagation delay | 9 ns | 9 ns | 9 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO |
| technology | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL |
| package instruction | DIP, DIP28,.3 | - | DIP, DIP28,.6 |
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