ML2259CIJ datasheet, PDF - EEWORLD Datasheet

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ML2259CIJ: DescriptionADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28; CategoryAnalog mixed-signal IC converter; File Size428KB，11 Pages; ManufacturerQorvo; Websitehttps://www.qorvo.com

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ML2259CIJ Overview

ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28

ML2259CIJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Qorvo
Parts packaging code	DIP
package instruction	DIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum analog input voltage	6.8 V
Minimum analog input voltage	-0.3 V
Maximum conversion time	850 µs
Converter type	ADC, SUCCESSIVE APPROXIMATION
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.15 mm
Maximum linear error (EL)	0.39%
Number of analog input channels	8
Number of digits	8
Number of functions	1
Number of terminals	28
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output bit code	OFFSET BINARY
Output format	PARALLEL, 8 BITS
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Sample and hold/Track and hold	SAMPLE
Maximum seat height	5.08 mm
Maximum slew rate	3 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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ML2259CIJ Related Products

	ML2259CIJ	ML2252BIJ	ML2252BMJ	ML2252CIJ	ML2259BIJ	ML2259BMJ
Description	ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28	ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, HERMETIC SEALED, CERDIP-20	ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, HERMETIC SEALED, CERDIP-20	ADC, Successive Approximation, 8-Bit, 1 Func, 2 Channel, Parallel, 8 Bits Access, CMOS, CDIP20, HERMETIC SEALED, CERDIP-20	ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28	ADC, Successive Approximation, 8-Bit, 1 Func, 8 Channel, Parallel, 8 Bits Access, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP28,.6	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP28,.6	DIP, DIP28,.6
Contacts	28	20	20	20	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	3A001.A.2.C	EAR99	EAR99	3A001.A.2.C
Maximum analog input voltage	6.8 V	6.8 V	6.8 V	6.8 V	6.8 V	6.8 V
Minimum analog input voltage	-0.3 V	-0.3 V	-0.3 V	-0.3 V	-0.3 V	-0.3 V
Maximum conversion time	850 µs	850 µs	850 µs	850 µs	850 µs	850 µs
Converter type	ADC, SUCCESSIVE APPROXIMATION	ADC, SUCCESSIVE APPROXIMATION	ADC, SUCCESSIVE APPROXIMATION	ADC, SUCCESSIVE APPROXIMATION	ADC, SUCCESSIVE APPROXIMATION	ADC, SUCCESSIVE APPROXIMATION
JESD-30 code	R-GDIP-T28	R-GDIP-T20	R-GDIP-T20	R-GDIP-T20	R-GDIP-T28	R-GDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
length	37.15 mm	24.51 mm	24.51 mm	24.51 mm	37.15 mm	37.15 mm
Maximum linear error (EL)	0.39%	0.195%	0.195%	0.39%	0.195%	0.195%
Number of analog input channels	8	2	2	2	8	8
Number of digits	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	28	20	20	20	28	28
Maximum operating temperature	85 °C	85 °C	125 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-55 °C
Output bit code	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY	OFFSET BINARY
Output format	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS	PARALLEL, 8 BITS
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP28,.6	DIP20,.3	DIP20,.3	DIP20,.3	DIP28,.6	DIP28,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Sample and hold/Track and hold	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE	SAMPLE
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum slew rate	3 mA	3 mA	3 mA	3 mA	3 mA	3 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	7.62 mm	7.62 mm	7.62 mm	15.24 mm	15.24 mm

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