This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
Data
Sheet
(Advan ce
Infor m a tio n)
Notice On Data Sheet Designations
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or V
IO
range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
ii
S71WS-N
S71WS-N_00_A6 July 19, 2006
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
™
Data Sheet
(Advance Information)
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz, 80 MHz
Package
– 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
– Wireless, –25° C to +85° C
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:
One or more flash memory die (for the S71WS512N, two S29WS256N devices are used)
CellularRAM Type 2 pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the
individual constituent datasheet for further details.
pSRAM
Flash Density
S29WS128N
S29WS256N
S29WS512N
32 Mb
S71WS128NB0
64 Mb
S71WS128NC0
S71WS256NC0
S71WS512NC0
S71WS256ND0
S71WS512ND0
128 Mb
For detailed specifications, please refer to the individual data sheets.
Document
S29WS-N
128 M CellularRAM Type 2
32 M CellularRAM Type 2
64 M CellularRAM Type 2
Publication Identification Number (PID)
S29WS-N_00
Cellram_04
Cellram_06
Cellram_07
Publication Number
S71WS-N_00
Revision
A
Amendment
6
Issue Date
July 19, 2006
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Data
Sheet
(Advan ce
Infor m a tio n)
1.
Product Selector Guide
Model
Numbers
AK
54
AP
AJ
S71WS128NB0
AN
AH
80
AM
AK
54
AP
AJ
S71WS128NC0
AN
AH
80
AM
AK
54
AP
AJ
S71WS256NC0
AN
AH
80
AM
WS256N
YK
54
YP
YJ
S71WS256ND0
YN
YH
80
YM
AK
54
AP
TJ
S71WS512NC0
TN
TH
80
TM
WS512N
EK
54
EP
EJ
S71WS512ND0
EN
EH
80
EM
Note:
0 (Protected), 1 (Unprotected [Default State])
80
1
128
66
66
1
0
54
1
0
2
9x12x1.4
0
80
1
64
66
66
1
11.6x8.0x1.4
0
2
54
1
0
2
80
1
0
2
11.6x8.0x1.2
128
66
66
1
0
54
1
0
2
9x12x1.2
0
80
1
64
66
66
1
0
2
54
1
0
2
11.6x8.0x1.2
80
1
0
2
WS128N
64
66
66
1
0
54
1
0
2
8.0X11.6X1.2
80
1
0
WS128N
32
66
66
1
0
54
1
0
2
8.0X11.6X1.2
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(See
Note)
0
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
Device
Flash
2
S71WS-N
S71WS-N_00_A6 July 19, 2006
D at a
S hee t
(Adva nce
In for m ation)
2.
Ordering Information
The order number is formed by a valid combinations of the following:
S71WS
256
N
C
0
BA
W
A
K
0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
RAM Supplier, DYB Power Up, Speed Combinations
K = 2 = CellularRAM 2, 0, 54 MHz
P = 2 = CellularRAM 2, 1, 54 MHz
J = 2 = CellularRAM 2, 0, 66 MHz
N = 2 = CellularRAM 2, 1, 66 MHz
H = 2 = CellularRAM 2, 0, 80 MHz
M = 2 = CellularRAM 2, 1, 80 MHz
Package Modifier
A = 8x11.6x1.2 mm, 84-ball FBGA
T = 8x11.6x1.4 mm, 84-ball FBGA
E = 9x12x1.4 mm, 84-ball FBGA
Y = 9x12x1.2 mm, 84-ball FBGA
Temperature Range
W = Wireless (-25°C to +85°C)
Package Type
BA = Very Thin FIne-Pitch BGA, Lead (Pb)-free Compliant Package
BF = Very Thin FIne-Pitch BGA, Lead (Pb)-free Package
After the program crashed, CeUnmountDBVol was not called. The next time the program was executed, CeMountDBVol (OPEN_ALLWAYS) failed. How can I solve this problem?...
Thank you for your attention and participation in this event. After checking everyone's weekly plan, we have selected the following 5 friends to participate in this M4 development board trial event. W...
As a hardware engineer, the most depressing thing is nothing more than this. You have worked hard to design a hardware circuit board, but you don’t have the copyright. You can’t do anything about it. ...
[i=s]This post was last edited by fxyc87 on 2014-7-4 11:08 [/i] LPC1500 Experience + @1- Getting Started with the Environment [Series of Tutorials] I have received the LPC1549 development board but ha...
Experiment name: Application of power amplifier in electrolysis device of sludge electric remediation technology
Purpose:
The one-step method removes and recovers Pb from urban sludge, striving to ach...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
1. Overview
Will passive devices
produce nonlinear intermodulation distortion? The answer is yes! Although there is no systematic theoretical analysis, it has been found in engineerin...[Details]
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
Introduction
Power subsystems are becoming more and more integrated into the overall system. Power systems have moved from being separate "essential dangerous devices" to being monitorable...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
1 Introduction
In recent years, there have been many major advances in the production technology and processes of automotive headlights, which have greatly improved the performance of automoti...[Details]
Different initialization between C8051F and 80C51 series microcontrollers
In the past 30 years, major electronic component manufacturers in the world have launched their own unique single-chip...[Details]
Continuity test
A variety of devices need to be checked for continuity, including cable assemblies, printed circuit boards, and connectors to ensure that these components have the expected contin...[Details]
At very low temperatures, certain metals and alloys lose their resistance to electric
current
and become
superconductors
. Two parameters that are often measured are the transition ...[Details]
1. Disadvantages of choosing too high a voltage level
Choosing too high a voltage level will result in too high an investment and a long payback period. As the voltage level increases, the...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
In the "digital pressure measurement" experimental device of applied physics, the subject technical knowledge of analog circuits, digital circuits, sensors and single-chip microcomputers is used. In o...[Details]
People who often surf the Internet until late at night, their families always complain that turning on the big lights in the living room affects their rest, but some people don't have keyboard ligh...[Details]
Almost everyone in a student dormitory has a bedside lamp. But if you want to read for a while after turning off the lights and don't want to disturb your roommates' sleep, you may need a reading l...[Details]
The fluorescent lamps and energy-saving lamps we commonly use now have greatly improved luminous efficiency compared with the earlier ordinary incandescent lamps and have been widely used. With the...[Details]