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GS8170DW18GC-333IT

Description
Standard SRAM, 1MX18, 5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
Categorystorage    storage   
File Size907KB,36 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
Download Datasheet Parametric View All

GS8170DW18GC-333IT Overview

Standard SRAM, 1MX18, 5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170DW18GC-333IT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionLBGA,
Contacts209
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B209
JESD-609 codee1
length22 mm
memory density18874368 bit
Memory IC TypeSTANDARD SRAM
memory width18
Humidity sensitivity level3
Number of functions1
Number of terminals209
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX18
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Preliminary
GS8170DW18/36/72C-333/300/250
209-Bump BGA
Commercial Temp
Industrial Temp
18Mb
Σ1x1
Double Late Write
SigmaRAM™ SRAM
250 MHz–333 MHz
1.8 V V
DD
1.8 V and 1.5 V I/O
Features
• Double Late Write mode
• JEDEC-standard SigmaRAM
pinout and package
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V I/O supply
• Dual Cycle Deselect
• Synchronous Burst operation
• Fully coherent read and write pipelines
• Echo Clock outputs track data output drivers
• ZQ mode pin for user-selectable output drive strength
• Byte write operation (9-bit bytes)
• 2 user-programmable chip enable inputs for easy depth
expansion
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
- 333
3.0 ns
1.6 ns
Bottom View
209-Bump, 14 mm x 22 mm BGA
1 mm Bump Pitch, 11 x 19 Bump Array
Pipeline mode
tKHKH
tKHQV
SigmaRAM Family Overview
GS8170DW18/36/72 SigmaRAMs (ΣRAM
™)
are built in
compliance with the
ΣRAM
pinout standard for synchronous
SRAMs. They are 18,874,368-bit (18Mb) SRAMs. These are
the first in a family of wide, very low voltage CMOS I/O
SRAMs designed to operate at the speeds needed to implement
economical high performance networking systems.
GSI's
ΣRAMs
are offered in a number of configurations that
emulate other synchronous SRAMs, such as Burst RAMs,
NBT, Late Write, or Double Data Rate (DDR) SRAMs. The
logical differences between the protocols employed by these
RAMs hinge mainly on various combinations of address
bursting, output data registering and write cueing. The
ΣRAM
family standard allows a user to implement the interface
protocol best suited to the task at hand.
Functional Description
Because
ΣRAMs
are synchronous devices, address, data
inputs, and read/write control inputs are captured on the rising
edge of the input clock. Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This feature
eliminates complex off-chip write pulse generation required by
asynchronous SRAMs and simplifies input signal timing.
The GS8170DW18/36/72C is configured to read in Pipeline
mode. In Pipeline mode, single data rate
ΣRAMs
incorporate a
rising-edge-triggered output register. For read cycles, a
pipelined SRAM’s output data is staged at the input of an edge-
triggered output register during the access cycle and then
released to the output drivers at the next rising edge of clock.
GS8170DW18/36/72C
ΣRAMs
are implemented with GSI's
high performance CMOS technology and are packaged in a
209-bump BGA.
Rev: 1.00d 6/2002
1/36
© 2002, Giga Semiconductor, Inc.
Specifications cited are design targets and are subject to change without notice. For latest documentation contact your GSI representative.

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