EEWORLDEEWORLDEEWORLD

Part Number

Search

K7N323601M-FC22

Description
ZBT SRAM, 1MX36, 2.8ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
Categorystorage    storage   
File Size721KB,28 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7N323601M-FC22 Overview

ZBT SRAM, 1MX36, 2.8ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165

K7N323601M-FC22 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeBGA
package instructionLBGA, BGA165,11X15,40
Contacts165
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time2.8 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)225 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length17 mm
memory density37748736 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals165
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum standby current0.1 A
Minimum standby current3.14 V
Maximum slew rate0.44 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width15 mm
K7N323601M
K7N321801M
Document Title
1Mx36 & 2Mx18-Bit Pipelined NtRAM
TM
1Mx36 & 2Mx18 Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
History
1. Initial document.
1. Add 165FBGA package
1. Update JTAG scan order
2. Speed bin merge.
From K7N3236(18)09M to K7N3236(18)01M
3. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
1. Change pin out for 165FBGA
- x18/x36 ; 11B => from A to NC , 2R ==> from NC to A
1. Insert pin at JTAG scan order of 165FBGA in connection with
pin out change
- x18/x36 ; insert Pin ID of 2R to BIT number of 69
1. Add Icc, Isb, Isb1 and Isb2 values.
1. Final datasheet release.
Draft Date
May. 10. 2001
Aug. 29. 2001
Dec. 31. 2001
Remark
Preliminary
Preliminary
Preliminary
0.3
0.4
Feb. 14. 2002
Apr. 20. 2002
Preliminary
Preliminary
0.5
1.0
May. 10. 2002
Sep. 26. 2002
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Sep 2002
Rev 1.0

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2610  1486  130  2295  1109  53  30  3  47  23 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号