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HYB39S256800DCL-7.5

Description
Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 12 X 8 MM, PLASTIC, TFBGA-54
Categorystorage    storage   
File Size2MB,61 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric View All

HYB39S256800DCL-7.5 Overview

Synchronous DRAM, 32MX8, 5.4ns, CMOS, PBGA54, 12 X 8 MM, PLASTIC, TFBGA-54

HYB39S256800DCL-7.5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerInfineon
Parts packaging codeBGA
package instruction12 X 8 MM, PLASTIC, TFBGA-54
Contacts54
Reach Compliance Codenot_compliant
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time5.4 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)133 MHz
I/O typeCOMMON
interleaved burst length1,2,4,8
JESD-30 codeR-PBGA-B54
JESD-609 codee0
length12 mm
memory density268435456 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals54
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA54,9X9,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
refresh cycle8192
Maximum seat height1.2 mm
self refreshYES
Continuous burst length1,2,4,8,FP
Maximum standby current0.002 A
Maximum slew rate0.19 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Data Sheet, Rev. 1.30, Feb. 2006
HYB39S256400D[C/T](L)
HYB39S256800D[C/T](L)
HYB39S256160D[C/T](L)
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