Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40
| Parameter Name | Attribute value |
| Maker | SIEMENS |
| package instruction | , |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE |
| Maximum access time | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH; BYTE ACCESS |
| JESD-30 code | R-PDSO-J40 |
| memory density | 4194304 bit |
| Memory IC Type | FAST PAGE DRAM |
| memory width | 16 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 40 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Certification status | Not Qualified |
| refresh cycle | 512 |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | J BEND |
| Terminal location | DUAL |





| HYB514171BJL-80 | HYB514171BJ-80 | |
|---|---|---|
| Description | Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40 | Fast Page DRAM, 256KX16, 80ns, CMOS, PDSO40 |
| Maker | SIEMENS | SIEMENS |
| Reach Compliance Code | unknown | unknow |
| ECCN code | EAR99 | EAR99 |
| access mode | FAST PAGE | FAST PAGE |
| Maximum access time | 80 ns | 80 ns |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH; BYTE ACCESS | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; BYTE ACCESS |
| JESD-30 code | R-PDSO-J40 | R-PDSO-J40 |
| memory density | 4194304 bit | 4194304 bi |
| Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM |
| memory width | 16 | 16 |
| Number of functions | 1 | 1 |
| Number of ports | 1 | 1 |
| Number of terminals | 40 | 40 |
| word count | 262144 words | 262144 words |
| character code | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 256KX16 | 256KX16 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified |
| refresh cycle | 512 | 512 |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | J BEND |
| Terminal location | DUAL | DUAL |