EDO DRAM Module, 32MX4, CMOS, PDMA32, STACK, TSOP-32
| Parameter Name | Attribute value |
| Maker | B&B Electronics Manufacturing Company |
| Parts packaging code | MODULE |
| package instruction | , |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FAST PAGE WITH EDO |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-PDMA-G32 |
| memory density | 134217728 bit |
| Memory IC Type | EDO DRAM MODULE |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 33554432 words |
| character code | 32000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32MX4 |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| DP3ED32MX4RKY5-DP-XX60C | 442BA8HCBC | DP3ED32MX4RKY5-DP-XX50C | DP3ED32MX4RKY5-DP-XX-60C | DP3ED32MX4R8KY5-DP-XX60C | DP3ED32MX4R8KY5-DP-XX-60C | DP3ED32MX4R8KY5-DP-XX50C | DP3ED32MX4R8KY5-DP-XX-50C | |
|---|---|---|---|---|---|---|---|---|
| Description | EDO DRAM Module, 32MX4, CMOS, PDMA32, STACK, TSOP-32 | Linear Motion 1/4 Watt Composition Slide Controls | EDO DRAM Module, 32MX4, CMOS, PDMA32, STACK, TSOP-32 | 32MX4 EDO DRAM MODULE, 60ns, PDSO32, STACK, LEADLESS, MODULE, TSOP-32 | EDO DRAM Module, 32MX4, CMOS, PDMA32, STACK, TSOP-32 | 32MX4 EDO DRAM MODULE, 60ns, PDSO32, STACK, LEADLESS, MODULE, TSOP-32 | EDO DRAM Module, 32MX4, CMOS, PDMA32, STACK, TSOP-32 | 32MX4 EDO DRAM MODULE, 50ns, PDSO32, STACK, LEADLESS, MODULE, TSOP-32 |
| Maker | B&B Electronics Manufacturing Company | - | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company | B&B Electronics Manufacturing Company |
| Parts packaging code | MODULE | - | MODULE | TSOP | MODULE | TSOP | MODULE | TSOP |
| Contacts | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown | unknown | unknown |
| access mode | FAST PAGE WITH EDO | - | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | - | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 code | R-PDMA-G32 | - | R-PDMA-G32 | R-PDSO-G32 | R-PDMA-G32 | R-PDSO-G32 | R-PDMA-G32 | R-PDSO-G32 |
| memory density | 134217728 bit | - | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit | 134217728 bit |
| Memory IC Type | EDO DRAM MODULE | - | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
| memory width | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | - | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 33554432 words | - | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
| character code | 32000000 | - | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 | 32000000 |
| Operating mode | SYNCHRONOUS | - | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32MX4 | - | 32MX4 | 32MX4 | 32MX4 | 32MX4 | 32MX4 | 32MX4 |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | - | MICROELECTRONIC ASSEMBLY | SMALL OUTLINE, PIGGYBACK, THIN PROFILE | MICROELECTRONIC ASSEMBLY | SMALL OUTLINE, PIGGYBACK, THIN PROFILE | MICROELECTRONIC ASSEMBLY | SMALL OUTLINE, PIGGYBACK, THIN PROFILE |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | - | YES | YES | YES | YES | YES | YES |
| technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |