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DP5Z1MW32PV3-12I

Description
Flash Module, 1MX32, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.163 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Categorystorage    storage   
File Size1MB,18 Pages
ManufacturerTwilight Technology Inc.
Download Datasheet Parametric View All

DP5Z1MW32PV3-12I Overview

Flash Module, 1MX32, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.163 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

DP5Z1MW32PV3-12I Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerTwilight Technology Inc.
Parts packaging codePGA
package instructionPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time120 ns
Other features100K ERASE/WRITE CYCLES
Spare memory width16
Data pollingNO
JESD-30 codeS-CPGA-P66
memory density33554432 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size32
Number of terminals66
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
page size64 words
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height4.1402 mm
Department size32K
Maximum standby current0.0004 A
Maximum slew rate0.16 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitNO
typeNOR TYPE
32 Megabit FLASH EEPROM
DP5Z1MW32PV3
DESCRIPTION:
The DP5Z1MW32PV3 ‘’VERSA-STACK’’ module is a memory subsystem
using DPAC Technologies’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers 32 Megabits of
FLASH EEPROM in a single package envelope of 1.090" x 1.090" x .163".
The DP5Z1MW32PV3 is built with 2 SLCC packages each containing
1Meg x 16 FLASH memory devices. Each SLCC is hermetically sealed,
making the module suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher
board density of memory than available with conventional through-hole,
surface mount, module or hybrid techniques.
A0 - A19
PIN NAMES
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enables
Power (+5 Volts)
Ground
No Connect
I/O0 - I/O31
FEATURES:
Organizations Available:
Fast Access Times:
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 128 Kbyte Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during
Power Transitions
66 - Pin PGA ‘’VERSA-STACK’’ Package
1 Meg x 32, 2 Meg x 16
CE0, CE1
WE
OE
V
DD
V
SS
N.C.
120, 150, 200ns (max.)
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
30A180-11
Rev. D 5/02
This document contains information on a product that is currently released to production at DPAC Technologies Corp.
DPAC reserves the right to change products or specifications herein without prior notice.
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