2SK2551
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSV)
2SK2551
Chopper Regulator, DC−DC Converter and Motor Drive
Applications
Low drain−source ON resistance
High forward transfer admittance
Low leakage current
Enhancement mode
: R
DS (ON)
= 7.2 mΩ (typ.)
Unit: mm
: |Y
fs
| = 50 S (typ.)
: I
DSS
= 100
μA
(max) (V
DS
= 50 V)
: V
th
= 1.5 to 3.0 V (V
DS
= 10 V, I
D
= 1 mA)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristics
Drain−source voltage
Drain−gate voltage (R
GS
= 20 kΩ)
Gate−source voltage
Drain current
DC
(Note 1)
Symbol
V
DSS
V
DGR
V
GSS
I
D
I
DP
P
D
E
AS
I
AR
E
AR
T
ch
T
stg
Rating
50
50
±20
50
200
150
894
50
15
150
−55~150
Unit
V
V
V
A
A
W
mJ
A
mJ
°C
°C
1. GATE
2. DRAIN (HEAT SINK)
3. SOURCE
Pulse (Note 1)
Drain power dissipation (Tc = 25°C)
Single pulse avalanche energy
(Note 2)
Avalanche current
Repetitive avalanche energy (Note 3)
Channel temperature
Storage temperature range
JEDEC
JEITA
TOSHIBA
―
―
2-16C1B
Weight: 4.6 g (typ.)
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Thermal resistance, channel to case
Thermal resistance, channel to ambient
Symbol
R
th (ch−c)
R
th (ch−a)
Max
0.833
50
Unit
°C / W
°C / W
Note 1: Ensure that the channel temperature does not exceed 150°C.
Note 2: V
DD
= 25 V, T
ch
= 25°C (initial), L = 440
μH,
R
G
= 25
Ω,
I
AR
= 50 A
Note 3: Repetitive rating: pulse width limited by maximum channel temperature
This transistor is an electrostatic-sensitive device.
Please handle with caution.
1
2009-09-29
2SK2551
Electrical Characteristics
(Ta = 25°C)
Characteristics
Gate leakage current
Drain cut−off current
Drain−source breakdown voltage
Gate threshold voltage
Drain−source ON resistance
Forward transfer admittance
Input capacitance
Reverse transfer capacitance
Output capacitance
Rise time
Symbol
I
GSS
I
DSS
V
(BR) DSS
V
th
R
DS (ON)
|Y
fs
|
C
iss
C
rss
C
oss
t
r
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
Test Condition
V
GS
= ±16 V, V
DS
= 0 V
V
DS
= 50 V, V
GS
= 0 V
I
D
= 10 mA, V
GS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
V
GS
= 10 V, I
D
= 25 A
V
DS
= 10 V, I
D
= 25 A
Min
—
—
50
1.5
—
30
—
—
—
—
Typ.
—
—
—
—
7.2
50
4000
800
2000
25
Max
±10
100
—
3.0
11
—
—
—
—
—
pF
Unit
μA
μA
V
V
mΩ
S
Turn−on time
Switching time
Fall time
t
on
—
40
—
ns
t
f
—
120
—
Turn−off time
Total gate charge (Gate−source
plus gate−drain)
Gate−source charge
Gate−drain (“miller”) charge
t
off
Q
g
Q
gs
Q
gd
V
DD
≈
40 V, V
GS
= 10 V, I
D
= 50 A
—
—
—
—
360
130
90
40
—
—
—
—
nC
Source−Drain Ratings and Characteristics
(Ta = 25°C)
Characteristics
Continuous drain reverse current
(Note 1)
Pulse drain reverse current
(Note 1)
Forward voltage (diode)
Reverse recovery time
Reverse recovered charge
Symbol
I
DR
I
DRP
V
DSF
t
rr
Q
rr
Test Condition
—
—
I
DR
= 50 A, V
GS
= 0 V
I
DR
= 50 A, V
GS
= 0 V
dI
DR
/ dt = 50 A/μs
Min
—
—
—
—
—
Typ.
—
—
—
140
77
Max
50
200
−1.7
—
—
Unit
A
A
V
ns
μC
Marking
Note: A line under a Lot No. identifies the indication of product
Labels.
Not underlined: [[Pb]]/INCLUDES > MCV
Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]]
K2551
Part No. (or abbreviation code)
Lot No.
Note
Please contact your TOSHIBA sales representative for details as
to environmental matters such as the RoHS compatibility of
Product. The RoHS is the Directive 2002/95/EC of the European
Parliament and of the Council of 27 January 2003 on the
restriction of the use of certain hazardous substances in electrical
and electronic equipment.
2
2009-09-29
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