BR24S64FVM-W datasheet, PDF - EEWORLD Datasheet

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BR24S64FVM-W: DescriptionEEPROM, 8KX8, Serial, CMOS, PDSO8, MSOP-8; Categorystorage storage; File Size1MB，16 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BR24S64FVM-W Overview

EEPROM, 8KX8, Serial, CMOS, PDSO8, MSOP-8

BR24S64FVM-W Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	MSOP
package instruction	MSOP-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
JESD-30 code	R-PDSO-G8
JESD-609 code	e2
length	2.9 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Package body material	PLASTIC/EPOXY
encapsulated code	VSSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	0.9 mm
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.7 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Copper (Sn/Cu)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2.8 mm

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BR24S64FVM-W Related Products

	BR24S64FVM-W	BR24S16NUX-W	BR24S32FVJ-W	BR24S32NUX-W	BR24S64FVT-W	BR24S64FVJ-W	BR24S64FV-W
Description	EEPROM, 8KX8, Serial, CMOS, PDSO8, MSOP-8	EEPROM, 2KX8, Serial, CMOS, PDSO8, 2 X 3 MM, VSON-8	EEPROM, 4KX8, Serial, CMOS, PDSO8, TSSOP-8	EEPROM, 4KX8, Serial, CMOS, PDSO8, 2 X 3 MM, VSON-8	EEPROM, 8KX8, Serial, CMOS, PDSO8, TSSOP-8	EEPROM, 8KX8, Serial, CMOS, PDSO8, TSSOP-8	EEPROM, 8KX8, Serial, CMOS, PDSO8, SSOP-8
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor	ROHM Semiconductor
Parts packaging code	MSOP	SON	SOIC	SON	SOIC	SOIC	SOIC
package instruction	MSOP-8	HVSON,	TSSOP-8	2 X 3 MM, VSON-8	TSOP1,	TSSOP-8	SSOP-8
Contacts	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
JESD-30 code	R-PDSO-G8	R-PDSO-N8	S-PDSO-G8	R-PDSO-N8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8
JESD-609 code	e2	e3	e2	e3	e2	e2	e2
length	2.9 mm	3 mm	3 mm	3 mm	4.4 mm	3 mm	4.4 mm
memory density	65536 bit	16384 bit	32768 bit	32768 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
word count	8192 words	2048 words	4096 words	4096 words	8192 words	8192 words	8192 words
character code	8000	2000	4000	4000	8000	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX8	2KX8	4KX8	4KX8	8KX8	8KX8	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VSSOP	HVSON	TSSOP	HVSON	TSOP1	TSSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Copper (Sn/Cu)	Matte Tin (Sn)	Tin/Copper (Sn/Cu)	Matte Tin (Sn)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)	Tin/Copper (Sn/Cu)
Terminal form	GULL WING	NO LEAD	GULL WING	NO LEAD	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.5 mm	0.65 mm	0.5 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	2.8 mm	2 mm	3 mm	2 mm	3 mm	3 mm	3 mm
Maximum seat height	0.9 mm	0.8 mm	1.1 mm	0.8 mm	1.1 mm	1.1 mm	-

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