|
M74HC259B1N |
M54HC259F1 |
M74HC259M1 |
M74HC259C1 |
| Description |
HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDIP16, PLASTIC, DIP-16 |
HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, CDIP16, FRIT SEALED, CERAMIC, DIP-16 |
HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PDSO16, MICRO, GULLWIING, PLASTIC, DIP-16 |
HC/UH SERIES, LOW LEVEL TRIGGERED D LATCH, TRUE OUTPUT, PQCC20, PLASTIC, LCC-20 |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
| Parts packaging code |
DIP |
DIP |
SOIC |
QLCC |
| package instruction |
DIP, DIP16,.3 |
DIP, DIP16,.3 |
MICRO, GULLWIING, PLASTIC, DIP-16 |
QCCJ, LDCC20,.4SQ |
| Contacts |
16 |
16 |
16 |
20 |
| Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
_compli |
| Other features |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH |
| series |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
| JESD-30 code |
R-PDIP-T16 |
R-GDIP-T16 |
R-PDSO-G16 |
S-PQCC-J20 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
D LATCH |
D LATCH |
D LATCH |
D LATCH |
| MaximumI(ol) |
0.004 A |
0.004 A |
0.004 A |
0.004 A |
| Number of digits |
1 |
1 |
1 |
1 |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
16 |
16 |
16 |
20 |
| Maximum operating temperature |
85 °C |
125 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
| Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
| Package body material |
PLASTIC/EPOXY |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
DIP |
SOP |
QCCJ |
| Encapsulate equivalent code |
DIP16,.3 |
DIP16,.3 |
SOP16,.25 |
LDCC20,.4SQ |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
| Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
CHIP CARRIER |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| power supply |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
| propagation delay (tpd) |
41 ns |
50 ns |
41 ns |
41 ns |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
5.1 mm |
5 mm |
1.75 mm |
4.57 mm |
| Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
6 V |
| Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
2 V |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
NO |
YES |
YES |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
J BEND |
| Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
1.27 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
| Trigger type |
LOW LEVEL |
LOW LEVEL |
LOW LEVEL |
LOW LEVEL |
| width |
7.62 mm |
7.62 mm |
3.9 mm |
8.9662 mm |
| Prop。Delay @ Nom-Sup |
48 ns |
57 ns |
48 ns |
- |