HPC16400EU20 datasheet, PDF - EEWORLD Datasheet

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HPC16400EU20: DescriptionIC MICROCONTROLLER, CPGA68, CERAMIC, PGA-68, Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，26 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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HPC16400EU20 Overview

IC MICROCONTROLLER, CPGA68, CERAMIC, PGA-68, Microcontroller

HPC16400EU20 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	CERAMIC, PGA-68
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Has ADC	NO
Address bus width	16
bit size	16
CPU series	HPC
maximum clock frequency	20 MHz
DAC channel	NO
DMA channel	YES
External data bus width	16
JESD-30 code	S-CPGA-P68
JESD-609 code	e0
length	28 mm
Number of I/O lines	56
Number of terminals	68
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PWM channel	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA68,11X11
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	0
Maximum seat height	3.175 mm
speed	20 MHz
Maximum slew rate	70 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	28 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

HPC16400EU20 Related Products

	HPC16400EU20	HPC36400ET20	HPC36400EL20	HPC36400EU20	HPC46400EU20	HPC46400EL20	HPC46400ET20	AFB0824SHB
Description	IC MICROCONTROLLER, CPGA68, CERAMIC, PGA-68, Microcontroller	IC MICROCONTROLLER, UUC84, TAPE PACKAGE-84, Microcontroller	IC 16-BIT, 20 MHz, MICROCONTROLLER, CQCC68, LDCC-68, Microcontroller	IC MICROCONTROLLER, CPGA68, CERAMIC, PGA-68, Microcontroller	IC MICROCONTROLLER, CPGA68, CERAMIC, PGA-68, Microcontroller	IC 16-BIT, 20 MHz, MICROCONTROLLER, CQCC68, LDCC-68, Microcontroller	IC MICROCONTROLLER, UUC84, TAPE PACKAGE-84, Microcontroller	THIS SPECIFICATION DEFINES THE ELECTRICAL AND MECHANICAL CHARACTERISTICS OF THE FAN HEATSINK
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	-
package instruction	CERAMIC, PGA-68	TAPE PACKAGE-84	LDCC-68	CERAMIC, PGA-68	CERAMIC, PGA-68	LDCC-68	TAPE PACKAGE-84	-
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	-
Has ADC	NO	NO	NO	NO	NO	NO	NO	-
Address bus width	16	16	16	16	16	16	16	-
bit size	16	16	16	16	16	16	16	-
CPU series	HPC	HPC	HPC	HPC	HPC	HPC	HPC	-
maximum clock frequency	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	-
DAC channel	NO	NO	NO	NO	NO	NO	NO	-
DMA channel	YES	YES	YES	YES	YES	YES	YES	-
External data bus width	16	16	16	16	16	16	16	-
JESD-30 code	S-CPGA-P68	X-XUUC-N84	S-CQCC-J68	S-CPGA-P68	S-CPGA-P68	S-CQCC-J68	X-XUUC-N84	-
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	-
length	28 mm	-	24.13 mm	28 mm	28 mm	24.13 mm	-	-
Number of I/O lines	56	56	56	56	56	56	56	-
Number of terminals	68	84	68	68	68	68	84	-
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	-
PWM channel	NO	NO	NO	NO	NO	NO	NO	-
Package body material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	-
encapsulated code	PGA	DIE	QCCJ	PGA	PGA	QCCJ	DIE	-
Encapsulate equivalent code	PGA68,11X11	TP84,1.2X1.3,.05	LDCC68,1.0SQ	PGA68,11X11	PGA68,11X11	LDCC68,1.0SQ	TP84,1.2X1.3,.05	-
Package shape	SQUARE	UNSPECIFIED	SQUARE	SQUARE	SQUARE	SQUARE	UNSPECIFIED	-
Package form	GRID ARRAY	UNCASED CHIP	CHIP CARRIER	GRID ARRAY	GRID ARRAY	CHIP CARRIER	UNCASED CHIP	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
RAM (bytes)	256	256	256	256	256	256	256	-
Maximum seat height	3.175 mm	-	3.429 mm	3.175 mm	3.175 mm	3.429 mm	-	-
speed	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	-
Maximum slew rate	70 mA	70 mA	70 mA	70 mA	70 mA	70 mA	70 mA	-
Maximum supply voltage	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
surface mount	NO	YES	YES	NO	NO	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	PIN/PEG	NO LEAD	J BEND	PIN/PEG	PIN/PEG	J BEND	NO LEAD	-
Terminal pitch	2.54 mm	-	1.27 mm	2.54 mm	2.54 mm	1.27 mm	-	-
Terminal location	PERPENDICULAR	UPPER	QUAD	PERPENDICULAR	PERPENDICULAR	QUAD	UPPER	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	28 mm	-	24.13 mm	28 mm	28 mm	24.13 mm	-	-
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	-

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