HM3-6561-9 datasheet, PDF - EEWORLD Datasheet

HM3-6561-9: DescriptionStandard SRAM, 256X4, 300ns, CMOS, PDIP18; Categorystorage storage; File Size183KB，5 Pages; ManufacturerHarris; Websitehttp://www.harris.com/

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HM3-6561-9 Overview

Standard SRAM, 256X4, 300ns, CMOS, PDIP18

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Harris
package instruction	DIP, DIP18,.3
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	300 ns
Other features	ADDRESS LATCH
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
memory density	1024 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	18
word count	256 words
character code	256
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X4
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum standby current	0.00001 A
Minimum standby current	2 V
Maximum slew rate	0.0063 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

	HM3-6561-9	HM3-6561B-9
Description	Standard SRAM, 256X4, 300ns, CMOS, PDIP18	Standard SRAM, 256X4, 220ns, CMOS, PDIP18
Is it Rohs certified?	incompatible	incompatible
package instruction	DIP, DIP18,.3	DIP, DIP18,.3
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	300 ns	220 ns
Other features	ADDRESS LATCH	ADDRESS LATCH
JESD-30 code	R-PDIP-T18	R-PDIP-T18
JESD-609 code	e0	e0
memory density	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	4	4
Number of functions	1	1
Number of ports	1	1
Number of terminals	18	18
word count	256 words	256 words
character code	256	256
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	256X4	256X4
Output characteristics	3-STATE	3-STATE
Exportable	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP
Encapsulate equivalent code	DIP18,.3	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum standby current	0.00001 A	0.00001 A
Minimum standby current	2 V	2 V
Maximum slew rate	0.0063 mA	0.0072 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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