UVPROM, 8KX8, 170ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
| Parameter Name | Attribute value |
| Maker | Rochester Electronics |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| Maximum access time | 170 ns |
| JESD-30 code | R-CDIP-T28 |
| length | 36.83 mm |
| memory density | 65536 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 8192 words |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 8KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Maximum seat height | 4.907 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | NMOS |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| TMS2764-17JL | TMS2764-25JL | TMS2764-35JL | |
|---|---|---|---|
| Description | UVPROM, 8KX8, 170ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, 8KX8, 250ns, NMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | UVPROM, |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Reach Compliance Code | unknown | unknown | unknown |
| Memory IC Type | UVPROM | UVPROM | UVPROM |
| package instruction | DIP, | DIP, | - |
| Maximum access time | 170 ns | 250 ns | - |
| JESD-30 code | R-CDIP-T28 | R-CDIP-T28 | - |
| length | 36.83 mm | 36.83 mm | - |
| memory density | 65536 bit | 65536 bit | - |
| memory width | 8 | 8 | - |
| Number of functions | 1 | 1 | - |
| Number of terminals | 28 | 28 | - |
| word count | 8192 words | 8192 words | - |
| character code | 8000 | 8000 | - |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | - |
| Maximum operating temperature | 70 °C | 70 °C | - |
| organize | 8KX8 | 8KX8 | - |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
| encapsulated code | DIP | DIP | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | IN-LINE | - |
| Parallel/Serial | PARALLEL | PARALLEL | - |
| Maximum seat height | 4.907 mm | 4.907 mm | - |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | - |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - |
| surface mount | NO | NO | - |
| technology | NMOS | NMOS | - |
| Temperature level | COMMERCIAL | COMMERCIAL | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | - |
| width | 15.24 mm | 15.24 mm | - |
Real-time operating system RTOS
Embedded System
MCU
FPGA/CPLD
Embedded System
Analogue and Mixed Signal
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