Hall ICs
DN8797MS-A
3 V operation Hall IC
s
Overview
The DN8797MS-A is a 3 V operation Hall IC which
includes a Hall element, amplifier circuit, Schmidt circuit,
stabilized power supply and temperature compensation
circuit which are integrated on a single chip with a fine
patterning technology. The magnetic input signal is out-
putted by being converted to high or low. We have im-
proved the conventional circuit to realize a stable opera-
tion covering from low to high supply voltage and from
low to high temperature.
1.45
0.40
+ 0.10
– 0.05
3
0.65
± 0.15
Unit: mm
0.16
+ 0.10
– 0.06
M
ain
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sc te
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1
2
0.95
0.95
1.90
± 0.20
+
2.90
– 0.20
0.05
10°
1.50
+ 0.25
– 0.05
2.80
+ 0.20
– 0.30
•
Wide operating supply voltage range
(V
CC
=
2.7 V to 14.4 V)
•
Wide operating ambient temperature (−40°C to
+85°C)
•
Package: Mini type (3-pin type)
(1.1 mm thick: Same as a standard transistor)
MINI-3D
s
Applications
•
DC brushless motor, fan motor, rotation sensor, detection of cover open/close (example for a cellular phone),
position sensor
s
Block Diagram
V
CC
2
ce
/D
isc
on
tin
ue
Ma
int
en
an
Constant
voltage source
56 kΩ
(typ.)
+ 0.20
0 to 0.1 1.10
– 0.10
0.30
1.10
+ 0.10
–
s
Features
Hall element
GND
3
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0.65
± 0.15
5°
Comparator
1
Out
Amplifier
0.40
± 0.20
1
DN8797MS-A
s
Pin Descriptions
Pin No.
1
2
3
Symbol
Out
V
CC
GND
Description
Output pin
Supply voltage pin
Ground pin
Hall ICs
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Parameter
Symbol
V
CC
Rating
18
18
Supply voltage
V
OUT
I
CC
P
D
Supply current
Power dissipation
120
Operating ambient temperature
Storage temperature
T
opr
T
stg
−20
to
+85
−55
to
+125
s
Absolute Maximum Ratings
Unit
V
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for T
a
=
25°C.
2. The reverse insertion of this IC will cause its breakdown.
3. It will operate normally in several tens of ms after power on.
4. This IC is designed for a general use and if you want to use for an automotive use, please consult our staff of the nearby
sales office beforehand.
s
Recommended Operating Range
Parameter
Supply voltage
Symbol
V
CC
Parameter
tin
Symbol
BH-L
BL-H
BW
ue
s
Electrical Characteristics at T
a
=
25°C
isc
Operating magnetic flux density 1
Operating magnetic flux density 2
an
Hysteresis width
Ma
int
en
Output voltage 1
Output voltage 2
Output voltage 3
Output voltage 4
V
OL1
V
OL2
V
OH1
V
OH2
−I
OS
I
CC1
I
CC2
Output short-circuited current
Supply current 1
Supply current 2
Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low.
2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high.
3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power
source. (V
CC
should be confined to the range of 2.7 V to 14.4 V.)
4. A supply current changes by maximum 1 mA when its output level varies from high to low.
2
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mA
°C
mW
°C
Range
Unit
V
2.7 to 14.4
Conditions
Min
−15
Typ
Max
−3
4
Unit
mT
V
CC
=
3 V
V
CC
=
3 V
V
CC
=
3 V
mT
0.2
mT
V
V
CC
=
14.4 V, I
O
=
5 mA, B
= −22
mT
0.07
0.30
V
CC
=
2.7 V, I
O
=
5 mA, B
= −22
mT
V
CC
=
14.4 V, I
O
= −20 µA,
B
= −3
mT
V
CC
=
2.7 V, I
O
= −20 µA,
B
= −3
mT
V
CC
=
14.4 V, B
= −3
mT
V
CC
=
2.7 V, B
= −3
mT
V
CC
=
14.4 V, B
= −3
mT, V
O
=
0 V
0.07
0.30
V
12.8
13.3
13.8
V
1.05
1.55
2.05
V
0.19
1.0
1.0
0.27
3.4
2.5
0.39
6.0
6.0
mA
mA
mA
ce
/D
on
Hall ICs
s
Caution on use of Hall ICs
DN8797MS-A
As the Hall IC is often used to detect movement, the position of a Hall IC may be changed, and there is the risk of
a change in detection level, if exposed to shock or vibration over a long period of time. Secure the IC by applying
adhesive to the package or placing in a dedicated case.
1. On mounting of the surface mount type (MINI-3D package)
When mounted on the printed circuit board, the Hall IC may be highly stressed by the warping that may occur from
soldering. This may also cause a change in the operating flux density characteristic and a deterioration of its resistance
to moisture.
3. On fixing a Hall IC with the holder
When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder
is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC.
If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and
the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture.
Sensitivity may also be changed by this stress.
4. Power supply line/power transmission line
If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line.
In this case, set the capacitor of 0.1
µF
to 10
µF
near a Hall IC to prevent it.
If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition
pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.).
5. V
CC
and GND
Do not reverse V
CC
and GND. If the V
CC
and GND pins are reversely connected, this IC will be destroyed. If the
IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become same as a forward biased
diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will flow through
the IC, ending up in its destruction. (This is common to Monolithic IC.)
Ma
int
en
6. Cautions on power ON of Hall IC
When a Hall IC is turned ON, the position of the magnet or looseness may change the output of a Hall IC, and a
pulse may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the
supply power is ON.
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2. On using flux in soldering
Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The
ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the
disconnection of the aluminum wiring on the surface of an IC chip.
3
4
DN8797MS-A
s
Technical Data
Ma
int
Output voltage
e
n
an
ce
/D
isc
on
0.5
•
Magneto-electro conversion characteristics
•
Position of a Hall element (unit in mm)
Distance from a package surface to sensor part: 0.71 mm
A Hall element is placed on the shaded part in the figure.
BH-L
tin
Pl
S
N
ue
di
1.2
BW
0.5
0.5
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M
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Hall ICs
Direction of applied magnetic field
Applied magnetic flux density B
BL-H
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)
If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–
Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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M
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Di
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isc
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tin
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