IC 128K X 8 FLASH 12V PROM, 200 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 200 ns |
| JESD-30 code | R-PDSO-G32 |
| JESD-609 code | e0 |
| length | 20.6 mm |
| memory density | 1048576 bit |
| Memory IC Type | FLASH |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 |
| Programming voltage | 12 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.8 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| type | NOR TYPE |
| width | 10.7 mm |
| TC58F1000F-20(TP1) | TC58F1000F-15(TP2) | TC58F1000F-15(TP1) | TC58F1000F-15(EL) | TC58F1000F-20(TP2) | TC58F1000F-20(EL) | |
|---|---|---|---|---|---|---|
| Description | IC 128K X 8 FLASH 12V PROM, 200 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 150 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 200 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM | IC 128K X 8 FLASH 12V PROM, 200 ns, PDSO32, 0.525 INCH, PLASTIC, SOP-32, Programmable ROM |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor | Toshiba Semiconductor |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| package instruction | SOP, | SOP, | SOP, | SOP, | SOP, | SOP, |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 200 ns | 150 ns | 150 ns | 150 ns | 200 ns | 200 ns |
| JESD-30 code | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 20.6 mm | 20.6 mm | 20.6 mm | 20.6 mm | 20.6 mm | 20.6 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 |
| Programming voltage | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| type | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| width | 10.7 mm | 10.7 mm | 10.7 mm | 10.7 mm | 10.7 mm | 10.7 mm |
京公网安备 11010802033920号
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