AMC DOC. #: AMC7584_E (LF)
Feb 2005
®
A
DD MICROTECH CORP.
DESCRIPTION
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
FEATURES
The AMC7584 series is a high performance low dropout
regulator rated for 7A output current. It is designed for use
in applications requiring low dropout characteristics over
rated current range. The AMC7584 series offers fixed 2.5V,
3.3V, 5V and adjustable output voltage versions. In addition,
the AMC7584 series features the device protections including
over current and thermal shutdown. Also, reverse battery
protection scheme limits the reverse current when the input
voltage falls below the output.
Input-Output differential of typical
1.1V at 7A and low quiescent current
Output current is excess of 7A
Reverse battery protection
Short circuit protection
Internal thermal overload protection
Available in 3L plastic TO-220 and
surface mount 3L TO-263 packages
Pin assignment identical to EZ1585B
and LT1585A series.
APPLICATIONS
PACKAGE PIN OUT
Pentium
®
Processor Supplies
PowerPC
TM
Supplies
Computer Add-On Cards
Other Applications Requiring Low
Dropout Voltage Over Rated Current.
AMC7584-2.5 – 2.5V Fixed
AMC7584-3.3 – 3.3V Fixed
AMC7584-5.0 – 5.0V Fixed
AMC7584-ADJ – Adjustable
V
IN
V
out
Gnd/Adj
3-Pin Plastic TO-220
(Top View)
V
IN
V
out
Gnd/Adj
3-Pin Plastic TO-263
Surface Mount
(Top View)
ORDER INFORMATION
Plastic TO-263
Plastic TO-220
ST
T
A
( C)
3-pin
3-pin
0 to 70
AMC7584-XXT
AMC7584-XXST
0 to 70
AMC7584-XXTF (Lead Free)
AMC7584-XXSTF (Lead Free)
0 to 70
AMC7584-ADJT
AMC7584-ADJST
0 to 70
AMC7584-ADJTF (Lead Free)
AMC7584-ADJSTF (Lead Free)
Note: 1.All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e.,
AMC7584-X.XSTT).
2.The letter “F” is marked for Lead Free process.
O
T
Copyright
©
2002, ADD Microtech Corp.
1
www.addmtek.com
AMC DOC. #: AMC7584_E (LF)
Feb 2005
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
TYPICAL APPLICATION
V
IN
≥
4V
AMC7584-
X.X
2.5V/3.3V/5V
C1
10µF
C2
22µF
AMC7584-X.X application schematic
V
IN
AMC7584 -
ADJ
ADJ
*C1
10µF
R1
1%
R2
1%
V
OUT
**C2
22µF
V
OUT
= V
REF
(1+(R2/R1)) + I
ADJ
R2
* REQUIRED IF REGULATOR IS
LOCATED FAR FROM POWER
SUPPLY FILTER
** DESIGN C2 AS CLOSE TO V
OUT
PIN
AS POSSIBLE
AMC7584-ADJ application schematic
Copyright
©
2002, ADD Microtech Corp.
2
www.addmtek.com
AMC DOC. #: AMC7584_E (LF)
Feb 2005
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
(Note 1)
7V
150
O
C
-65
O
C to 150
O
C
300
O
C
ABSOLUTE MAXIMUM RATINGS
Input Voltage (V
IN
)
Operating Junction temperature
Storage Temperature Range
Lead temperature (Soldering, 10 seconds)
Note 1:
Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground.
Currents are positive into, negative out of the specified terminal.
THERMAL DATA
T, ST PACKAGE:
Thermal Resistance-Junction to Tab,
θ
JT
Thermal Resistance-Junction to Ambient,
θ
JA
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
T
J
= T
A
+ (P
D
× θ
JA
)., all of the above assume no ambient airflow.
BLOCK DIAGRAM
V
IN
3.0
O
C /W
45
O
C /W
V
OUT
THERMAL
LIMIT
1.25V
V
REF
GND
AMC7584-X.X circuit schematic
V
IN
1.25V
V
REF
THERMAL
LIMIT
V
OUT
ADJ
AMC7584-ADJ circuit schematic
Copyright
©
2002, ADD Microtech Corp.
3
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AMC DOC. #: AMC7584_E (LF)
Feb 2005
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
Input Voltage
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol Recommended Operating Conditions Units
Min.
Typ.
Max.
V
IN
4.0
7
V
I
O
0.010
1.0
10
7
A
µF
µF
Load Current (with adequate heatsinking)
Input Capacitor (V
IN
to GND)
Output Capacitor with ESR of 10Ω max., (V
OUT
to GND)
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, these specifications apply over the operating ambient temperature of 0
O
C to +70
O
C for
AMC7584; I
O
= 10mA, C
OUT
= 10
µF,
and are for DC characteristics only. (Low duty cycle pulse testing techniques
are used which maintains junction and case temperatures equal to the ambient temperature.)
AMC7584
Parameter
Symbol
Test Conditions
Units
Min. Typ. Max.
AMC7584-2.5
V
IN
=
4V, T
A
= 25
O
C
2.475 2.500 2.525
Output Voltage AMC7584-3.3
AMC7584-5.0
Reference
Voltage
AMC7584-ADJ
V
REF
V
OI
V
OL
V
O
V
IN
=
V
OUT
+ 2V, T
A
= 25
O
C
3.267 3.300 3.333
4.950 5.000 5.050
1.238 1.250 1.262
I
O
= 10 mA to 7A
4V
≤
V
IN
≤
7V
V
IN
= 4V, 10mA
≤
I
O
≤
7A
V
IN
= V
OUT
+ 2V, 10mA
≤
I
O
≤
7A
4V
≤
V
IN
≤
7V
I
O
= 100mA
I
O
= 7A
0.05
0.2
%
1.230 1.250 1.270
0.005
0.2
V
%
V
Line Regulation (Note 2)
AMC7584-2.5
Load regulation AMC7584-3.3
(Note 2)
AMC7584-5.0
AMC7584-ADJ
Dropout Voltage
Quiescent Current
Adj pin current
(AMC7584-ADJ only)
Current Limit
Output Noise Voltage (Note 3)
Long Term Stability (Note 3)
V
I
Q
I
ADJ
I
CL
0.010 0.030
1.100 1.300
8
50
7
8
150
20
13
120
V
mA
µA
A
µV
RMS
mV/1000hr
4V
≤
V
IN
≤
7V, 100mA
≤
I
O
≤
7A
4V
≤
V
IN
≤
7V, 100mA
≤
I
O
≤
7A
4V
≤
V
IN
≤
7V
V
O RMS
10H
Z
– 100kH
Z
, I
O
= 5mA
Ripple rejection (Note 3)
R
R
f
O
= 120H
Z
, 1V
RMS
, I
O
= 100mA
66
dB
Note 2: Line and load regulation is guaranteed up to maximum power dissipation determined by input/output
differential and the output current. However, the maximum power will not be available over the full
input/output voltage range.
Note 3: These parameters, although guaranteed, are not tested in production prior to shipment
Copyright
©
2002, ADD Microtech Corp.
4
www.addmtek.com
AMC DOC. #: AMC7584_E (LF)
Feb 2005
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
APPLICATION INFORMATION:
Thermal Consideration
Maximum Power Calculation:
T
J(MAX)
– T
A(MAX)
θ
JA
O
T
J
( C): Maximum recommended junction temperature
T
A
(
O
C): Ambient temperature of the application
θ
JA
(
O
C/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator
:
P
D(MAX)
=
[(V
IN(MAX)
- V
OUT(NOM)
)]
×
I
OUT(NOM)
+ V
IN(MAX)
×
I
Q
P
D(MAX)
=
Where: V
OUT(NOM)
= the nominal output voltage
I
OUT(NOM)
= the nominal output current, and
I
Q
= the quiescent current the regulator consumes at I
OUT(MAX)
V
IN(MAX)
= the maximum input voltage
Then
θ
JA
= (150
O
C – T
A
) / P
D
Thermal consideration:
When power consumption is over about 1.2W( at 70
o
C ambient temperature), additional heat sink is required to control the
junction temperature below 125
O
C.
The junction temperature is: Tj = P
D
(θ
JT
+
θ
CS
+
θ
SA
) + T
A
P
D
:Dissipated power.
θ
JT
:Thermal resistance from the junction to the mounting tab of the package.
θ
CS
:
T hermal resistance through the interface between the IC and the surface on which it is mounted. (typically,
θ
CS
< 1.0°C / W)
θ
SA
:Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
59
PCB
θ
SA
(°C / W )
2
PCB heat sink size (mm ) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
(Bottom View)
Copyright
©
2002, ADD Microtech Corp.
5
www.addmtek.com
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