BAS16XV2T1,
BAS16XV2T5,
SBAS16XV2T1G
Switching Diode
Features
•
•
•
•
•
•
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Reflow Temperature: 260°C
Extremely Small SOD−523 Package
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
•
Pb−Free Packages are Available
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Continuous Forward Current
Peak Forward Surge Current
Repetitive Peak Forward Current
Non−Repetitive Peak Forward Current
(Square Wave, T
J
= 25°C prior to surge)
t = 1
ms
t = 1 ms
t=1s
Symbol
V
R
I
F
I
FM(surge)
I
FRM
I
FSM
4.0
1.0
0.5
Value
75
200
500
500
Unit
V
mA
mA
mA
A
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1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
PLASTIC
MARKING
DIAGRAM
A6 MG
G
1
2
A6 = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BAS16XV2T1
BAS16XV2T1G
BAS16XV2T5G
SBAS16XV2T1G
Package
SOD−523
SOD−523
(Pb−Free)
SOD−523
(Pb−Free)
SOD−523
(Pb−Free)
Shipping†
3000 / Tape & Reel
3000 / Tape & Reel
8000 / Tape & Reel
3000 /T ape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings
are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation, (Note 1)
T
A
= 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
1. FR-5 Minimum Pad.
Symbol
P
D
Max
200
1.57
R
θJA
T
J
, T
stg
635
−55
to 150
Unit
mW
mW/°C
°C/W
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2011
October, 2011
−
Rev. 6
1
Publication Order Number:
BAS16XV2T1/D
BAS16XV2T1, BAS16XV2T5, SBAS16XV2T1G
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Reverse Voltage Leakage Current
(V
R
= 75 V)
(V
R
= 75 V, T
J
= 150°C)
(V
R
= 25 V, T
J
= 150°C)
Reverse Breakdown Voltage
(I
BR
= 100
mA)
Forward Voltage
(I
F
= 1.0 mA)
(I
F
= 10 mA)
(I
F
= 50 mA)
(I
F
= 150 mA)
Diode Capacitance (V
R
= 0, f = 1.0 MHz)
Forward Recovery Voltage
(I
F
= 10 mA, t
r
= 20 ns)
Reverse Recovery Time
(I
F
= I
R
= 10 mA, R
L
= 50
Ω)
Stored Charge
(I
F
= 10mA to V
R
= 5.0V, R
L
= 500
Ω)
820
Ω
+10 V
2.0 k
100
μH
0.1
μF
D.U.T.
50
Ω
OUTPUT
PULSE
GENERATOR
50
Ω
INPUT
SAMPLING
OSCILLOSCOPE
V
R
INPUT SIGNAL
90%
I
R
i
R(REC)
= 1.0 mA
OUTPUT PULSE
(I
F
= I
R
= 10 mA; MEASURED
at i
R(REC)
= 1.0 mA)
I
F
0.1
μF
t
r
10%
t
p
t
I
F
t
rr
t
I
R
−
−
−
75
1.0
50
30
−
mA
V
(BR)
V
F
V
mV
−
−
−
−
−
−
−
−
715
855
1000
1250
2.0
1.75
6.0
45
pF
V
ns
pC
C
D
V
FR
t
rr
Q
S
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (I
F
) of 10 mA.
Notes:
2. Input pulse is adjusted so I
R(peak)
is equal to 10 mA.
Notes:
3. t
p
» t
rr
Figure 1. Recovery Time Equivalent Test Circuit
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2
BAS16XV2T1, BAS16XV2T5, SBAS16XV2T1G
100
IF, FORWARD CURRENT (mA)
IR , REVERSE CURRENT (μA)
10
T
A
= 150°C
T
A
= 85°C
10
T
A
= - 40°C
1.0
T
A
= 125°C
T
A
= 85°C
0.1
T
A
= 55°C
0.01
T
A
= 25°C
1.0
T
A
= 25°C
0.1
0.2
0.4
0.6
0.8
1.0
V
F
, FORWARD VOLTAGE (VOLTS)
1.2
0.001
0
10
20
30
40
V
R
, REVERSE VOLTAGE (VOLTS)
50
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
CD, DIODE CAPACITANCE (pF)
0.64
0.60
0.56
0.52
0
2
4
6
8
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
BAS16XV2T1, BAS16XV2T5, SBAS16XV2T1G
PACKAGE DIMENSIONS
SOD−523
CASE 502−01
ISSUE E
−X−
D
−Y−
E
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
b
0.08
1
M
2
X Y
TOP VIEW
A
c
H
E
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
0.48
2X
1.80
0.40
2X
2X
L2
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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