BAS21 / A / C / S
225mW SMD Switching Diode
Small Signal Diode
SOT-23
A
F
Features
Fast switching speed
Surface device type mounting
Moisture sensitivity level 1
Matte Tin(Sn) lead finish with Nickel(Ni) underplate
Pb free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
B
E
C
D
G
Mechanical Data
Case :SOT-23 small outline plastic package
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Weight : 0.008gram (approximately)
Marking Code : JS,JS2,JS3,JS4
Dimensions
A
B
C
D
E
F
G
Unit (mm)
Min
2.80
1.20
0.30
1.80
2.25
0.90
Max
3.00
1.40
0.50
2.00
2.55
1.20
Unit (inch)
Min
0.110
0.047
0.012
0.071
0.089
0.035
Max
0.118
0.055
0.020
0.079
0.100
0.043
0.550 REF
0.022 REF
Pin Configuration
BAS21
BAS21A
BAS21C
BAS21S
Ordering Information
Package
Part No.
Packing
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
3K / 7" Reel
Marking
JS
JS2
JS3
JS4
JS
JS2
JS3
JS4
SOT-23 BAS21 RF
SOT-23 BAS21A RF
SOT-23 BAS21C RF
SOT-23 BAS21S RF
SOT-23 BAS21 RFG
SOT-23 BAS21A RFG
SOT-23 BAS21C RFG
SOT-23 BAS21S RFG
Suggested PAD Layout
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Power Dissipation
Repetitive Peak Reverse Voltage
Repetitive Peak Forward Current
Mean Forward Current
Non-Repetitive Peak Forward Surge Current (Note 1)
Thermal Resistance (Junction to Ambient)
Junction and Storage Temperature Range
(Note 2)
Symbol
P
D
V
RRM
I
FRM
I
O
I
FSM
RθJA
T
J
, T
STG
Value
225
250
625
200
1
500
-55 to + 150
Units
mW
V
mA
mA
A
°C/W
°C
Notes:1. Test Condition : 8.3ms Single half Sine-Wave Superimposed on Rated Load (JEDEC Method) Pulse Width=1
μsec
Notes:2. Valid provided that electrodes are kept at ambient temperature
Version : C10
BAS21 / A / C / S
225mW SMD Switching Diode
Small Signal Diode
Electrical Characteristics
Electrical Characteristics
Type Number
Reverse Breakdown Voltage
Forward Voltage
Reverse Leakage Current
I
R
=
I
F
=
I
F
=
V
R
=
100μA
100mA
200mA
200V
f=1.0MHz
Symbol
V
(BR)
V
F
I
R
C
J
Trr
Min
250
-
-
-
-
-
Max
-
1.00
1.25
0.1
5
50.0
Units
V
V
V
μA
pF
ns
V
R
=1V,
Junction Capacitance
Reverse Recovery Time I
F
=I
R
=10mA, R
L
=100Ω, I
RR
=1mA
Tape & Reel specification
TSC label
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
P0
d
T
A
C
B
F
W
P1
E
Item
Carrier width
Carrier length
Carrier depth
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Symbol
A
B
C
d
D
D1
D2
E
F
P0
P1
T
W
W1
Dimension(mm)
3.15 ±0.10
2.77 ±0.10
1.22 ±0.10
1.50 ± 0.10
178 ± 1
55 Min
13.0 ± 0.20
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.05
0.229 ±0.013
8.10 ±0.20
12.30 ±0.20
W1
D
D2
D1
Direction of Feed
Version : C10
BAS21 / A / C / S
225mW SMD Switching Diode
Small Signal Diode
Rating and Sharacteristic Curves
FIG 1 Typical Forward Characteristics
Instantaneous Forward Current (mA)
1000
o
FIG 2 Reverse Current vs Junction Temperature
100
10
Reverse Current (uA)
100
T
Ta=25°C
a
=25 C
V
R
=200V
10
1
1
0.1
0.1
0.01
0
Instantaneous Forward Voltage (V)
0.3
0.6
0.9
1.2
0.01
1.8
2.1
0
40
80
120
160
200
1.5
Inataneous Forward Voltage (V)
T
J
,Junction Temperature (°C)
FIG 3 Admissible Power Dissipation Curve
250
Power Dissipation (mW)
200
150
100
50
0
0
25
50
75
100
125
150
175
200
Ambient Temperature (°C)
Version : C10