WPBLN Series – 2012 (0805)
MULTILAYER CERAMIC BALUN TRANSFORMER
2.4 GHz ISM Band Working Frequency
Page 1 of 7
Jan.-2002
FEATURES
1.
2.
3.
4.
5.
6.
7.
Multilayer LTCC ( Low Temperature Cofired Ceramics ) Technology
Miniatured Size 2.00 x 1.25 x 0.95 mm
3
Low Insertion Loss reduces power consumption
Low inband Amplitude and Phase imbalance enable high performance wireless system operation.
Enable for DC Biasing of PA or Mixer
Suitable for 2.45 GHz Working Frequency Operation
Special Balance/ Unbalance impedance is upon requested.
APPLICATIONS
1.
2.
2.4GHz ISM Band RF Application
Bluetooth, Wireless LAN, HomeRF
CONSTRUCTION
Identified Mark
N.C
GND
Balanced port
Unbalanced port
GND or DC feed
Balanced port
Fig 1. Outline of 2.4GHz Balun
DESCRIPTION
Our new ceramic Balun Transformer specified for 2.45 GHz ISM Band application,
as shown in fig-1. Both of Wireless LAN IEEE 802.11b, and Bluetooth
TM
typically located on this unlicensed frequency
band which range covers from 2.4GHz to 2.5GHz (2.4835GHz). To fulfil the in-band and out-band frequency requirements,
this ceramic Balun has been designed to a low Amplitude imbalance and Phase imbalance, wide bandwidth (-10dB) as
well as l ow insertion loss characteristics through our advanced LTCC (Low Temperature Co-fired Ceramic)
technology and superior product design via 3D EM Simulation Skill.
This ceramic Balun has a rectangular ceramic body with a tiny dimension of 2.00 x 1.25 x 0.95 mm
3
future meet the SMT
automation and miniaturization requirements on modern portable devices.
DIMENSIONS
Figure
a
1
6
b
c
2
5
L
d
3
4
Symbol
L
W
T
A
B
Dimension
2.00 ± 0.15 mm
1.25 ± 0.15 mm
0.95 ± 0.10 mm
0.20 ± 0.20 mm
0.30 ± 0.20 mm
0.35 ± 0.20 mm
0.65 ± 0.20 mm
Terminals
1
2
3
4
5
6
Connection
Unbalanced port
Ground or DC feed
Balanced port
Balanced port
Ground
Non Connection
W
t
C
D
MARKING
: No marking, the white block means up-side and unbalanced input
Page 2 of 7
Jan.-2002
SOLDER LAND PATTERN
Figure
b
a
c
a
Symbol
a
b
c
d
Dimens ion (mm)
1.00
±
0.10
0.35
±
0.10
0.80
±
0.10
0.65
±
0.10
d
Line width to be design to match 50Ω characteristic impedance, depending
on PCB material and thickness
ELECTRICAL CHARACTERISTICS
n
WPBLN Series
Frequency
Part Nr.
(MHz)
Impedance (
Ω
)
Unbalanced Balanced
50
50
50
50
100
200
Return Loss
(dB) Min.
10
10
10
Inband Amplitude
imbalance (dB) Max.
2.0
2.0
2.0
Inband Phase
imbalance (degree)
180
±
10
180
±
10
180
±
10
Insertion
Loss (dB)
1.2
1.0
1.0
WPBLN001A
WPBLN002A
WPBLN003A
2450
±
50
2450
±
50
2450
±
50
PACKING CODE : WPBLN00xA*
x
Specification
Code X from 1 ~ 3
dependent on
different
Balanced port
impedance
specification
X =
1:
50/
50
X =
2:
50/
100
X =
3:
50/
200
*
Packing Code
T : 7” Reeled
G : 13” Reeled
B : Bulk
X : SFC product
Page 3 of 7
Jan.-2002
TYPICAL FREQUENCY CHARACTERISTICS
(1). Amplitude balance (WPBLN001A)
Remark: -4.1dB which should include 0.4dB microstrip line loss
(2). Phase balance (WPBLN001A)
Page 4 of 7
Jan.-2002
RELIABILITY TEST
n
Mechanical performance
Test item
Solderability
Test condition / Test method
Solder temp.
: 235
±
5°C
Specification
At least 80% of a surface of
each terminal electrode must
be covered by fresh solder.
Immersion time: 2
±
1 sec
Solder: SN63
Resistance to soldering heat
Solder: Sn63
Preheating temperature: 150
±
10°C
Solder Temperature: 260
±
5°C
Immersion time: 10
±
1 sec
Measurement to be made after keeping at room
temp. for 24±2 hrs.
No mechanical damage.
Ceramic surface shall not be
exposed in the middle of the
termination or on the
terminated product edge by
leaching.
Drop Test
Height : 75 cm
Direction : 3 directions
Times : 3 times for each direction.
No mechanical damage.
Samples shall satisfy electrical
specification after test..
n
Environmental characteristics
Test item
Test condition / Test method
Humidity:90% to 95% R.H.
Tempertaure:40±2°C
Time: 500±24 hours.
Measurement: After placing for 24 hours Minimum.
Specification
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Humidity (steady conditions)
Temperature cycle
1.
2.
3.
4.
30±3 minutes at -40°C±3°C,
10~15 minutes at room temperature,
30±3 minutes at +85°±3°C,
10~15 minutes at room temperature,
No mechanical damage.
Samples shall satisfy
electrical specification after
test.
Total 100 continuous cycles
Measurement after placing for 48±2 hrs min.
High temperature
Temperature: 85°C±2°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
Low temperature
Temperature: -40°C±3°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Page 5 of 7
Jan.-2002
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