CD4024BFBH datasheet, PDF - EEWORLD Datasheet

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CD4024BFBH: DescriptionCD4024BFBH; Categorylogic logic; File Size618KB，9 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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CD4024BFBH

CD4024BFBH Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
Counting direction	UP
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Load/preset input	NO
Logic integrated circuit type	BINARY COUNTER
Maximum Frequency@Nom-Sup	3500000 Hz
MaximumI(ol)	0.00036 A
Operating mode	ASYNCHRONOUS
Number of functions	1
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Prop。Delay @ Nom-Sup	486 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
total dose	1M Rad(Si) V

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CD4024BFBH Related Products

	CD4024BFBH	CD4020BFSR	CD4024BFBR	CD4024BFSR	CD4020AF	CD4024BQSR	CD4020BFBH	CD4020BFBR	CD4024BQSH	CD4020BQSR
Description	CD4024BFBH	CD4020BFSR	CD4024BFBR	CD4024BFSR	CD4020AF	CD4024BQSR	CD4020BFBH	CD4020BFBR	CD4024BQSH	CD4020BQSR
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	_compli	_compli	_compli	_compli
Counting direction	UP	UP	UP	UP	UP	UP	UP	UP	UP	UP
JESD-30 code	R-XDIP-T14	R-XDIP-T16	R-XDIP-T14	R-XDIP-T14	R-XDIP-T16	R-XDFP-F14	R-XDIP-T16	R-XDIP-T16	R-XDFP-F14	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
Load/preset input	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Logic integrated circuit type	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	14	16	14	14	16	14	16	16	14	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DFP	DIP	DIP	DFP	DFP
Encapsulate equivalent code	DIP14,.3	DIP16,.3	DIP14,.3	DIP14,.3	DIP16,.3	FL14,.3	DIP16,.3	DIP16,.3	FL14,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	FLATPACK	FLATPACK
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	YES	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
package instruction	DIP, DIP14,.3	DIP, DIP16,.3	DIP, DIP14,.3	DIP, DIP14,.3	-	DFP, FL14,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL14,.3	DFP, FL16,.3
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	-	50 pF	50 pF	50 pF	50 pF	50 pF
MaximumI(ol)	0.00036 A	0.00036 A	0.00036 A	0.00036 A	-	0.00036 A	0.00036 A	0.00036 A	0.00036 A	0.00036 A
power supply	5/15 V	5/15 V	5/15 V	5/15 V	-	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Filter level	38535Q/M;38534H;883B	38535V;38534K;883S	38535Q/M;38534H;883B	38535V;38534K;883S	-	38535V;38534K;883S	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535V;38534K;883S	38535V;38534K;883S
total dose	1M Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	100k Rad(Si) V	-	100k Rad(Si) V	1M Rad(Si) V	100k Rad(Si) V	1M Rad(Si) V	100k Rad(Si) V

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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